@inproceedings{13e0a31fee4549f2a9bc3dd9ee24f235,
title = "Efficiency of dispenser with nozzle technology in assembly",
abstract = "The material quality, species and orientation of nozzle usually dominate the throughput, bonding reliability and bonding yield of dispenser in bonding technology of assembly. Promoting these needs is a key factor to enter the fine-pitch package field and satisfies the high-density packaging competition.",
author = "Wang, \{Mu Chun\} and Huang, \{Kuo Shu\} and Chen, \{Shuang Yuan\} and Hsieh, \{Zhen Ying\} and Yang, \{Hsin Chia\} and Liu, \{Chuan Hsi\} and Lin, \{Chii Ruey\}",
year = "2010",
doi = "10.1109/ICEPT.2010.5583781",
language = "English",
isbn = "9781424481422",
series = "Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010",
pages = "476--479",
booktitle = "Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010",
note = "2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 ; Conference date: 16-08-2010 Through 19-08-2010",
}