Efficiency of dispenser with nozzle technology in assembly

Mu Chun Wang*, Kuo Shu Huang, Shuang Yuan Chen, Zhen Ying Hsieh, Hsin Chia Yang, Chuan Hsi Liu, Chii Ruey Lin

*此作品的通信作者

研究成果: 書貢獻/報告類型會議論文篇章

摘要

The material quality, species and orientation of nozzle usually dominate the throughput, bonding reliability and bonding yield of dispenser in bonding technology of assembly. Promoting these needs is a key factor to enter the fine-pitch package field and satisfies the high-density packaging competition.

原文英語
主出版物標題Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
頁面476-479
頁數4
DOIs
出版狀態已發佈 - 2010
事件2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 - Xi'an, 中国
持續時間: 2010 八月 162010 八月 19

出版系列

名字Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010

其他

其他2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
國家/地區中国
城市Xi'an
期間2010/08/162010/08/19

ASJC Scopus subject areas

  • 電氣與電子工程

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