Editorial: IEDMS 2016

^*此作品的通信作者

研究成果: 雜誌貢獻 › 編者言 › 同行評審

原文	英語
頁（從 - 到）	207
頁數	1
期刊	Microelectronics Reliability
卷	83
DOIs	https://doi.org/10.1016/j.microrel.2017.12.037
出版狀態	已發佈 - 2018 4月

ASJC Scopus subject areas

@article{cba243a642d242d89d1029afbf731ce6,

title = "Editorial: IEDMS 2016",

author = "Liu, {Chuan Hsi} and Cheng, {Chun Hu} and Cheng, {Chin Pao} and Liou, {Juin J.}",

year = "2018",

month = apr,

doi = "10.1016/j.microrel.2017.12.037",

language = "English",

volume = "83",

pages = "207",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Elsevier Limited",

}

TY - JOUR

T1 - Editorial

T2 - IEDMS 2016

AU - Liu, Chuan Hsi

AU - Cheng, Chun Hu

AU - Cheng, Chin Pao

AU - Liou, Juin J.

PY - 2018/4

Y1 - 2018/4

UR - http://www.scopus.com/inward/record.url?scp=85040109838&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85040109838&partnerID=8YFLogxK

U2 - 10.1016/j.microrel.2017.12.037

DO - 10.1016/j.microrel.2017.12.037

M3 - Editorial

AN - SCOPUS:85040109838

SN - 0026-2714

VL - 83

SP - 207

JO - Microelectronics Reliability

JF - Microelectronics Reliability

ER -