Directly Determining the Coefficient of Thermal Expansion of High-power Light-emitting Diodes by Optical Coherence Tomography

Ting Wei Yeh, Chun Yang Chou, Chun Ying Huang, Yung Chi Yao, Yi Kai Haung, Meng Tsan Tsai, Ya Ju Lee*

*此作品的通信作者

研究成果: 書貢獻/報告類型會議論文篇章

摘要

The coefficient of thermal expansion (CTE) is a physical quantity that indicates the thermal expansion value of a material upon heating. For advanced thermal management, the accurate and immediate determination of the CTE of packaging materials is gaining importance because the demand for high-power lighting-emitting diodes (LEDs) is currently increasing. In this study, we used optical coherence tomography (OCT) to measure the CTE of an InGaN-based (λ = 450 nm) high-power LED encapsulated in polystyrene resin. The distances between individual interfaces of the OCT images were observed and recorded to derive the instantaneous CTE of the packaged LED under different injected currents. The LED junction temperature at different injected currents was established with the forward voltage method. Most importantly, this work validates the hypothesis that OCT can provide an alternative way to directly and nondestructively determine the spatially resolved CTE of the packaged LED device, which offers significant advantages over traditional CTE measurement techniques.

原文英語
主出版物標題2018 Conference on Lasers and Electro-Optics, CLEO 2018 - Proceedings
發行者Institute of Electrical and Electronics Engineers Inc.
ISBN(列印)9781943580422
出版狀態已發佈 - 2018 8月 6
事件2018 Conference on Lasers and Electro-Optics, CLEO 2018 - San Jose, 美国
持續時間: 2018 5月 132018 5月 18

出版系列

名字2018 Conference on Lasers and Electro-Optics, CLEO 2018 - Proceedings

會議

會議2018 Conference on Lasers and Electro-Optics, CLEO 2018
國家/地區美国
城市San Jose
期間2018/05/132018/05/18

ASJC Scopus subject areas

  • 儀器
  • 原子與分子物理與光學

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