Development of composite vertical wet etching for silicon material

Mao Jung Huang, Chun Ming Chang, Nien Nan Chu, Yu Hsiang Tang, Chii Rong Yang

研究成果: 書貢獻/報告類型會議貢獻

摘要

In this research, we combined the electrochemical etching (ECE) and the metal-assisted chemical etching (MACE) to develop a composite vertical etching process for silicon material and then discuss the etching results influenced by experimental parameters. The experimental results show that the developed composite etching process has faster etching rate than both electrochemical etching and metal-assisted chemical etching process. When a bias of 0.25 V is applied and the catalytic material is 10 nm in thickness, a 30 μm-depth vertical structure can be generated which is 3 times than the structure yield by metal-assisted chemical etching.

原文英語
主出版物標題9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014
發行者Institute of Electrical and Electronics Engineers Inc.
頁面564-567
頁數4
ISBN(電子)9781479947270
DOIs
出版狀態已發佈 - 2014 一月 1
事件9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014 - Waikiki Beach, 美国
持續時間: 2014 四月 132014 四月 16

其他

其他9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014
國家美国
城市Waikiki Beach
期間14/4/1314/4/16

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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  • 引用此

    Huang, M. J., Chang, C. M., Chu, N. N., Tang, Y. H., & Yang, C. R. (2014). Development of composite vertical wet etching for silicon material. 於 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE-NEMS 2014 (頁 564-567). [6908875] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/NEMS.2014.6908875