TY - JOUR
T1 - Development of an original electromagnetic damping-controlled horizontal cutting mechanism for microwire-EDM
AU - Chen, Shun Tong
AU - Huang, Li Wen
AU - Kuo, Jin Pin
AU - Pai, Tin Cheng
N1 - Publisher Copyright:
© 2019 Elsevier B.V.
PY - 2020/4
Y1 - 2020/4
N2 - In this study, an original ‘electromagnetic damping-controlled horizontal cutting mechanism’ is designed and proposed for precisely controlling micro-scale wire-tension for cutting a microstructure array. The electromagnetic damper uses a set of three annular electromagnets equally distributed with their end-faces orientated toward a mild-steel disc. This arrangement is located at the front of the cutting mechanism. The cutting mechanism also consists of a set of microgroove rollers, a wire-electrode guide, and an auxiliary guide designed to suppress wire-wriggling and wire-swaying in order to deliver a tungsten wire of Ø13 μm diameter at a steady state over the long-term. Experimental verification is conducted on B-NPD (boron-doped nano-polycrystalline diamond), which possesses a high melting-point and high electrical resistivity characteristics, to establish the feasibility of cutting such difficult-to-machine materials. A 'one-cut one-skim' machining approach is used whereby the surface flatness and the dimensional accuracy of the slot-wall can be improved. Experimental results found that the wire feed-rate during the finish-cutting stage can be used at a rate greater than that of the rough-cutting stage. The resultant diamond microstructure array is of high-consistency and aspect-ratio at 1:22, demonstrating that the electromagnetic damping-controlled horizontal cutting mechanism can precisely and stably control the tension and running speed of the microwire.
AB - In this study, an original ‘electromagnetic damping-controlled horizontal cutting mechanism’ is designed and proposed for precisely controlling micro-scale wire-tension for cutting a microstructure array. The electromagnetic damper uses a set of three annular electromagnets equally distributed with their end-faces orientated toward a mild-steel disc. This arrangement is located at the front of the cutting mechanism. The cutting mechanism also consists of a set of microgroove rollers, a wire-electrode guide, and an auxiliary guide designed to suppress wire-wriggling and wire-swaying in order to deliver a tungsten wire of Ø13 μm diameter at a steady state over the long-term. Experimental verification is conducted on B-NPD (boron-doped nano-polycrystalline diamond), which possesses a high melting-point and high electrical resistivity characteristics, to establish the feasibility of cutting such difficult-to-machine materials. A 'one-cut one-skim' machining approach is used whereby the surface flatness and the dimensional accuracy of the slot-wall can be improved. Experimental results found that the wire feed-rate during the finish-cutting stage can be used at a rate greater than that of the rough-cutting stage. The resultant diamond microstructure array is of high-consistency and aspect-ratio at 1:22, demonstrating that the electromagnetic damping-controlled horizontal cutting mechanism can precisely and stably control the tension and running speed of the microwire.
KW - B-NPD microstructure array
KW - Electromagnetic damper
KW - Horizontal cutting mechanism
KW - Microwire tension
KW - One-cut one-skim
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U2 - 10.1016/j.jmatprotec.2019.116538
DO - 10.1016/j.jmatprotec.2019.116538
M3 - Article
AN - SCOPUS:85075996475
SN - 0924-0136
VL - 278
JO - Journal of Materials Processing Technology
JF - Journal of Materials Processing Technology
M1 - 116538
ER -