Development of a thin CBN grinding-tool by compound process

Shun-Tong Chen, Yun Cheng Lai

研究成果: 書貢獻/報告類型會議論文篇章

1 引文 斯高帕斯(Scopus)

摘要

This study presents a compound process combining composite electroforming with wire Electrical Discharge Machining (w-EDM) for developing a thin cubic boron nitride (CBN) grinding-tool. A precisely designed set-up in which a small compound depositing tank providing effectual convection of a compound electroplating solution to help fabricate a CBN grinding-blank is presented. A funneled entrance design for converging CBN grits in the working tank and creating a depositing effect on the substrate is employed and proposed. Considerable micro CBN abrasives are evenly embedded into the nickel-based coating layer, which offers enough abrasives for grinding-edge. Subsequently, the coated grinding-blank is trued and dressed by using w-EDM to form a multiple thin CBN grinding-tool. Experimental results indicate that the electroforming process can create a Ni-based CBN layer of high-integrity under current density of 2 ASD and concentration of 8.6 g/l CBN grits. Moreover, the CBN grinding-edge of 10 μm in thickness (each edge) can be achieved.

原文英語
主出版物標題Information Technology for Manufacturing Systems IV
頁面359-363
頁數5
DOIs
出版狀態已發佈 - 2013
事件4th International Conference on Information Technology for Manufacturing Systems, ITMS 2013 - Auckland, 新西兰
持續時間: 2013 八月 282013 八月 29

出版系列

名字Applied Mechanics and Materials
421
ISSN(列印)1660-9336
ISSN(電子)1662-7482

其他

其他4th International Conference on Information Technology for Manufacturing Systems, ITMS 2013
國家新西兰
城市Auckland
期間2013/08/282013/08/29

ASJC Scopus subject areas

  • Engineering(all)

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