Development of a novel stack package to fabricate high density memory modules for high-end application

INIS

• applications 100%
• bonding 33%
• communities 33%
• cost 33%
• demand 33%
• density 100%
• epoxides 33%
• increasing 33%
• leakage 33%
• microelectronics 33%
• miniaturization 33%
• packaging 66%
• performance 33%
• power 33%
• reliability 33%
• size 33%
• speed 33%
• stacks 100%
• steady-state conditions 33%
• wires 66%
• yields 33%

Computer Science

• End Application 100%
• Normal Operation 50%
• Operating Speed 50%