Development of a micro diamond grinding tool by compound process

Shun-Tong Chen, Ming Yi Tsai, Yun Cheng Lai, Ching Chang Liu

研究成果: 雜誌貢獻文章

32 引文 (Scopus)

摘要

This study presents a novel micro-diamond tool which is 100 μm in diameter and that allows precise and micro-grinding during miniature die machining. A novel integrated process technology is proposed that combines "micro-EDM" with "precision composite electroforming" for fabricating micro-diamond tools. First, the metal substrate is cut down to 50 μm in diameter using WEDG, then, the micro-diamonds with 0-2 μm grain is "plated" on the surface of the substrate by composite electroforming, thereby becoming a multilayer micro-grinding tool. The thickness of the electroformed layer is controlled to within 25 μm. The nickel and diamond form the bonder and cutter, respectively. To generate good convection for the electroforming solution, a partition designed with an array of drilled holes is recommended and verified. Besides effectively decreasing the impact energy of the circulatory electroforming solution, the dispersion of the diamond grains and displacement of the nickel ions are noticeably improved. Experimental results indicate that good circularity of the diamond tool can be obtained by arranging the nickel spherules array on the anode. To allow the diamond grains to converge toward the cathode, so as to increase the opportunity of reposing on the substrate, a miniature funnel mold is designed. Then the distribution of the diamond grains on the substrate surface is improved. A micro-ZrO2 ceramic ferrule is grinded to verify the proposed approach. The surface roughness of Ra = 0.085 μm is obtained. It is demonstrated that the micro-diamond grinding tool with various outer diameters is successfully developed in this study. The suggested approach, which depends on machining applications, can be applied during the final machining. Applications include dental drilling tools, precision optic dies, molds and tools, and biomedical instruments.

原文英語
頁(從 - 到)4698-4703
頁數6
期刊Journal of Materials Processing Technology
209
發行號10
DOIs
出版狀態已發佈 - 2009 六月 1

指紋

Diamond
Grinding wheels
Grinding
Strombus or kite or diamond
Diamonds
Electroforming
Nickel
Substrate
Machining
Substrates
Die
Composite
Integrated Process
Drilling
Composite materials
Molds
Surface Roughness
Convection
Multilayer
Optics

ASJC Scopus subject areas

  • Ceramics and Composites
  • Computer Science Applications
  • Metals and Alloys
  • Industrial and Manufacturing Engineering

引用此文

Development of a micro diamond grinding tool by compound process. / Chen, Shun-Tong; Tsai, Ming Yi; Lai, Yun Cheng; Liu, Ching Chang.

於: Journal of Materials Processing Technology, 卷 209, 編號 10, 01.06.2009, p. 4698-4703.

研究成果: 雜誌貢獻文章

Chen, Shun-Tong ; Tsai, Ming Yi ; Lai, Yun Cheng ; Liu, Ching Chang. / Development of a micro diamond grinding tool by compound process. 於: Journal of Materials Processing Technology. 2009 ; 卷 209, 編號 10. 頁 4698-4703.
@article{57e95814104e4b9e91f382c8710adcb4,
title = "Development of a micro diamond grinding tool by compound process",
abstract = "This study presents a novel micro-diamond tool which is 100 μm in diameter and that allows precise and micro-grinding during miniature die machining. A novel integrated process technology is proposed that combines {"}micro-EDM{"} with {"}precision composite electroforming{"} for fabricating micro-diamond tools. First, the metal substrate is cut down to 50 μm in diameter using WEDG, then, the micro-diamonds with 0-2 μm grain is {"}plated{"} on the surface of the substrate by composite electroforming, thereby becoming a multilayer micro-grinding tool. The thickness of the electroformed layer is controlled to within 25 μm. The nickel and diamond form the bonder and cutter, respectively. To generate good convection for the electroforming solution, a partition designed with an array of drilled holes is recommended and verified. Besides effectively decreasing the impact energy of the circulatory electroforming solution, the dispersion of the diamond grains and displacement of the nickel ions are noticeably improved. Experimental results indicate that good circularity of the diamond tool can be obtained by arranging the nickel spherules array on the anode. To allow the diamond grains to converge toward the cathode, so as to increase the opportunity of reposing on the substrate, a miniature funnel mold is designed. Then the distribution of the diamond grains on the substrate surface is improved. A micro-ZrO2 ceramic ferrule is grinded to verify the proposed approach. The surface roughness of Ra = 0.085 μm is obtained. It is demonstrated that the micro-diamond grinding tool with various outer diameters is successfully developed in this study. The suggested approach, which depends on machining applications, can be applied during the final machining. Applications include dental drilling tools, precision optic dies, molds and tools, and biomedical instruments.",
keywords = "Composite electroforming, Diamond tool, Micro-EDM",
author = "Shun-Tong Chen and Tsai, {Ming Yi} and Lai, {Yun Cheng} and Liu, {Ching Chang}",
year = "2009",
month = "6",
day = "1",
doi = "10.1016/j.jmatprotec.2008.10.055",
language = "English",
volume = "209",
pages = "4698--4703",
journal = "Journal of Materials Processing Technology",
issn = "0924-0136",
publisher = "Elsevier BV",
number = "10",

}

TY - JOUR

T1 - Development of a micro diamond grinding tool by compound process

AU - Chen, Shun-Tong

AU - Tsai, Ming Yi

AU - Lai, Yun Cheng

AU - Liu, Ching Chang

PY - 2009/6/1

Y1 - 2009/6/1

N2 - This study presents a novel micro-diamond tool which is 100 μm in diameter and that allows precise and micro-grinding during miniature die machining. A novel integrated process technology is proposed that combines "micro-EDM" with "precision composite electroforming" for fabricating micro-diamond tools. First, the metal substrate is cut down to 50 μm in diameter using WEDG, then, the micro-diamonds with 0-2 μm grain is "plated" on the surface of the substrate by composite electroforming, thereby becoming a multilayer micro-grinding tool. The thickness of the electroformed layer is controlled to within 25 μm. The nickel and diamond form the bonder and cutter, respectively. To generate good convection for the electroforming solution, a partition designed with an array of drilled holes is recommended and verified. Besides effectively decreasing the impact energy of the circulatory electroforming solution, the dispersion of the diamond grains and displacement of the nickel ions are noticeably improved. Experimental results indicate that good circularity of the diamond tool can be obtained by arranging the nickel spherules array on the anode. To allow the diamond grains to converge toward the cathode, so as to increase the opportunity of reposing on the substrate, a miniature funnel mold is designed. Then the distribution of the diamond grains on the substrate surface is improved. A micro-ZrO2 ceramic ferrule is grinded to verify the proposed approach. The surface roughness of Ra = 0.085 μm is obtained. It is demonstrated that the micro-diamond grinding tool with various outer diameters is successfully developed in this study. The suggested approach, which depends on machining applications, can be applied during the final machining. Applications include dental drilling tools, precision optic dies, molds and tools, and biomedical instruments.

AB - This study presents a novel micro-diamond tool which is 100 μm in diameter and that allows precise and micro-grinding during miniature die machining. A novel integrated process technology is proposed that combines "micro-EDM" with "precision composite electroforming" for fabricating micro-diamond tools. First, the metal substrate is cut down to 50 μm in diameter using WEDG, then, the micro-diamonds with 0-2 μm grain is "plated" on the surface of the substrate by composite electroforming, thereby becoming a multilayer micro-grinding tool. The thickness of the electroformed layer is controlled to within 25 μm. The nickel and diamond form the bonder and cutter, respectively. To generate good convection for the electroforming solution, a partition designed with an array of drilled holes is recommended and verified. Besides effectively decreasing the impact energy of the circulatory electroforming solution, the dispersion of the diamond grains and displacement of the nickel ions are noticeably improved. Experimental results indicate that good circularity of the diamond tool can be obtained by arranging the nickel spherules array on the anode. To allow the diamond grains to converge toward the cathode, so as to increase the opportunity of reposing on the substrate, a miniature funnel mold is designed. Then the distribution of the diamond grains on the substrate surface is improved. A micro-ZrO2 ceramic ferrule is grinded to verify the proposed approach. The surface roughness of Ra = 0.085 μm is obtained. It is demonstrated that the micro-diamond grinding tool with various outer diameters is successfully developed in this study. The suggested approach, which depends on machining applications, can be applied during the final machining. Applications include dental drilling tools, precision optic dies, molds and tools, and biomedical instruments.

KW - Composite electroforming

KW - Diamond tool

KW - Micro-EDM

UR - http://www.scopus.com/inward/record.url?scp=67349266842&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=67349266842&partnerID=8YFLogxK

U2 - 10.1016/j.jmatprotec.2008.10.055

DO - 10.1016/j.jmatprotec.2008.10.055

M3 - Article

AN - SCOPUS:67349266842

VL - 209

SP - 4698

EP - 4703

JO - Journal of Materials Processing Technology

JF - Journal of Materials Processing Technology

SN - 0924-0136

IS - 10

ER -