Design of self-alignment devices with fluidic self-assembly for flip chip packages in batch processing

Tien Li Chang, Chieh Fu Chang, Ya Wei Lee, Chun Hu Cheng, Cheng Ying Chou, Meng Chi Huang

研究成果: 書貢獻/報告類型會議貢獻

指紋 深入研究「Design of self-alignment devices with fluidic self-assembly for flip chip packages in batch processing」主題。共同形成了獨特的指紋。

Engineering & Materials Science