Design of self-alignment devices with fluidic self-assembly for flip chip packages in batch processing

Tien Li Chang, Chieh Fu Chang, Ya Wei Lee, Chun Hu Cheng, Cheng Ying Chou, Meng Chi Huang

研究成果: 書貢獻/報告類型會議貢獻

摘要

An advanced LED multi-die-bonding integration using a fluidic self-assembly technique is proposed in the field of flip chip packages. Different form the conventional pick-and-place methods for a single LED die bonding, the fluidic approach is a relatively new design and a batch process, which can achieve not only die self-alignment but die self-assembly. Here, the size of LED die is 1-mm-square chip with the thickness of 0.3 mm. Due to the smaller size of LED die, the die-bonding process is still in need of finding a suitable approach and breakthrough. In this study, our design of fluidic self-assembly device is based on the experimental test and simulation results. The device design is the gas-flow channels with the magnetism. The width, height and length of each gas-flow channel are 1.1 mm, 0.5 mm, and 1 cm, respectively. With the restriction of the channel width, this structure design can control well to die self-alignment. In addition, the design of two circular structures in the channel can form a flat rim to achieve the die self-assemble. This mechanism of fluidic approach can be useful to the LED die self-alignment and self-assembly in the future batch processing.

原文英語
主出版物標題Micro Nano Devices, Structure and Computing Systems III
發行者Trans Tech Publications
頁面79-83
頁數5
ISBN(列印)9783038350750
DOIs
出版狀態已發佈 - 2014 一月 1
事件3rd International Conference on Micro Nano Devices, Structure and Computing Systems, MNDSCS 2014 - , 新加坡
持續時間: 2014 三月 12014 三月 2

出版系列

名字Advanced Materials Research
918
ISSN(列印)1022-6680

其他

其他3rd International Conference on Micro Nano Devices, Structure and Computing Systems, MNDSCS 2014
國家新加坡
期間14/3/114/3/2

ASJC Scopus subject areas

  • Engineering(all)

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