Damage-reduced process revealed by photoluminescence in photoelectrochemical etching GaN

J. M. Hwang, J. T. Hsieh, H. L. Hwang, Wei-Hsiu Hung

研究成果: 雜誌貢獻會議論文同行評審

摘要

Photoelectrochemical (PEC) etching technique has been proven to be an effective method to etch GaN. Despite its success, investigations on etching-induced damage are still scare. In this work, the damage induced by PEC etching of GaN in KOH electrolyte was studied. Photoluminescence (PL) spectroscopy was used to explore the origin of etching-induced damaged layer. From the variable temperature PL measurements, the origin of etching-induced damage was attributed to be the defect complex of VGa-ON (gallium vacancy bonds to oxygeon on nitrogen antisite). With determination of the defect origin, the electronic transition in the etch damage-related yellow luminescence (YL) band was suggested to be deep donor-like state to shallow-acceptor transition. In addition, a post-treatment method with boiled KOH chemical etching was developed to remove the thin damaged layer. In this method, crystallographic etching characteristics of boiled KOH was observed to assist in the formation of smooth sidewall facets. As revealed by the reduction of yellow luminescence, we propose this novel technique as a near damage-free etching method.

原文英語
期刊Materials Research Society Symposium - Proceedings
595
出版狀態已發佈 - 2000 一月 1
事件The 1999 MRS Fall Meeting - Symposium W 'GaN and Related Alloys' - Boston, MA, USA
持續時間: 1999 十一月 281999 十二月 3

ASJC Scopus subject areas

  • 材料科學(全部)
  • 凝聚態物理學
  • 材料力學
  • 機械工業

指紋

深入研究「Damage-reduced process revealed by photoluminescence in photoelectrochemical etching GaN」主題。共同形成了獨特的指紋。

引用此