Automated reconstruction of 3D object on embedded system for mobile apps

Yu Hsien Sung*, Kahlil Muchtar, Hsiang Erh Lai, Chia Hung Yeh, Chia Yen Chen

*此作品的通信作者

研究成果: 書貢獻/報告類型會議論文篇章

2 引文 斯高帕斯(Scopus)

摘要

In this paper, a light-weight 3D object reconstruction system is proposed. It aims to fulfill the increasing demand for fast and reliable 3D reconstruction in a mobile environment. Thereby, people can directly use their own device (e.g. mobile phone or tablet) to reconstruct desired objects into 3D models. The system is implemented and tested on an embedded board, MIO-5250, that is equipped with the recent Intel Atom N2600 series. With massive development of 3D technology, we believe the application proposed in this work would have rapidly expanding usages in the near future.

原文英語
主出版物標題2014 IEEE 3rd Global Conference on Consumer Electronics, GCCE 2014
發行者Institute of Electrical and Electronics Engineers Inc.
頁面65-66
頁數2
ISBN(電子)9781479951451
DOIs
出版狀態已發佈 - 2014 二月 3
對外發佈
事件2014 IEEE 3rd Global Conference on Consumer Electronics, GCCE 2014 - Tokyo, 日本
持續時間: 2014 十月 72014 十月 10

出版系列

名字2014 IEEE 3rd Global Conference on Consumer Electronics, GCCE 2014

其他

其他2014 IEEE 3rd Global Conference on Consumer Electronics, GCCE 2014
國家/地區日本
城市Tokyo
期間2014/10/072014/10/10

ASJC Scopus subject areas

  • 電氣與電子工程

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