TY - GEN
T1 - Application of computational intelligence techniques for optimization of solder volume in PCB assembly
AU - Hsu, Hui Po
AU - Wang, Jian Hung
AU - Chen, Li Fei
AU - Su, Chao Ton
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2018/1/8
Y1 - 2018/1/8
N2 - Application of insufficient or excessive amounts of the solder paste during the solder paste printing process can result in circuit issues, such as an incomplete circuit when the paste applied is insufficient and a short circuit when the paste applied is excessive. The former is resulting from a solder open; the latter is resulting from the forming of a solder bridge. This study attempts to optimize solder volume in a printed circuit board assembly. Computational intelligence techniques, including neural network, genetic algorithm, particle swarm optimization, and simulated annealing, were used to address this problem. A real case study was presented to confirm the effectiveness of the computational intelligence techniques.
AB - Application of insufficient or excessive amounts of the solder paste during the solder paste printing process can result in circuit issues, such as an incomplete circuit when the paste applied is insufficient and a short circuit when the paste applied is excessive. The former is resulting from a solder open; the latter is resulting from the forming of a solder bridge. This study attempts to optimize solder volume in a printed circuit board assembly. Computational intelligence techniques, including neural network, genetic algorithm, particle swarm optimization, and simulated annealing, were used to address this problem. A real case study was presented to confirm the effectiveness of the computational intelligence techniques.
KW - Computational intelligence
KW - Genetic algorithm
KW - Neural network
KW - Particle swarm optimization
KW - Printed circuit board
KW - Simulated annealing
UR - https://www.scopus.com/pages/publications/85046035879
UR - https://www.scopus.com/pages/publications/85046035879#tab=citedBy
U2 - 10.1109/SAI.2017.8252265
DO - 10.1109/SAI.2017.8252265
M3 - Conference contribution
AN - SCOPUS:85046035879
T3 - Proceedings of Computing Conference 2017
SP - 1347
EP - 1349
BT - Proceedings of Computing Conference 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2017 SAI Computing Conference 2017
Y2 - 18 July 2017 through 20 July 2017
ER -