Analysis of promising copper wire bonding in assembly consideration

Mu Chun Wang*, Zhen Ying Hsieh, Kuo Shu Huang, Chuan Hsi Liu, Chii Ruey Lin

*此作品的通信作者

研究成果: 書貢獻/報告類型會議論文篇章

4 引文 斯高帕斯(Scopus)

摘要

Although gold wire proposes the good characteristics such as malleability and stabilization, in the cost consideration to promote the package competition, the copper wire provides the better attraction. Therefore, the assembly houses gradually impress on the copper wire bonding technology desirably replacing the traditional gold wire bonding, especially in high-pin-count package. Besides the cost superiority, the electrical resistivity of copper, 1.7 μΩ-cm, is lower than that of gold, 2.2 μΩ-cm, and aluminum, 2.65 μΩ-cm. Furthermore, the mechanical characteristics of copper, such as Youngs modulus and rigidity modulus (130 GPa and 48 GPa, respectively), are larger than those of gold (78 GPa and 27 GPa, respectively). In copper wire bonding, the wire ball on pad demonstrates the excellent neck intensity and the arc shape of the copper wire is more stable. This superiority in molding process is singularly and significantly noticeable.

原文英語
主出版物標題IMPACT Conference 2009 International 3D IC Conference - Proceedings
頁面108-111
頁數4
DOIs
出版狀態已發佈 - 2009
事件IMPACT Conference 2009 International 3D IC Conference - Taipei, 臺灣
持續時間: 2009 十月 212009 十月 23

出版系列

名字IMPACT Conference 2009 International 3D IC Conference - Proceedings

其他

其他IMPACT Conference 2009 International 3D IC Conference
國家/地區臺灣
城市Taipei
期間2009/10/212009/10/23

ASJC Scopus subject areas

  • 硬體和架構
  • 電氣與電子工程
  • 電子、光磁材料

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