An ultra sensitive DNA detection by using gold nanoparticle multilayer in nano-gap electrodes

Chien Ying Tsai, Tien Li Chang, Chun Chi Chen, Fu Hsiang Ko, Ping Hei Chen*

*此作品的通信作者

研究成果: 雜誌貢獻會議論文同行評審

29 引文 斯高帕斯(Scopus)

摘要

This paper reports an electrical DNA detection method that detects target DNA at concentrations as low as 1 fM by using self-assembly multilayer gold nanoparticle structure between nano-gap electrodes. The distance of the gap between the electrodes is 300 nm and the height of the electrodes is 65 nm. A multilayer gold nanoparticle structure can be built on thin film of SiO 2 silicon wafer. Bifunctional organic molecules are used to build up gold nanoparticle monolayer on the wafer substrate. After hybridization among target DNA, 5′-end thiol-modified probe DNA and 3′-end thiol-modified capture DNA; a second layer of gold nanoparticle is built up through a self-assembly process between gold nanoparticles and thiol-modified end of probe DNA. When the applied voltage is the same, electrical current through multilayer gold nanoparticle structure is much greater than that through monolayered gold nanoparticle structure. Therefore, target DNA in sample solution can be detected through a significant degradation in electrical resistance from monolayered gold nanoparticle to multilayer gold nanoparticle structures. The concentration of target DNA in tested sample solutions ranges from 1 fM to 100 pM. The linear I-V curves of multilayer gold nanoparticle structures indicate the device proposed in this study can detect target DNA concentrations as low as 1 fM. Additional approaches are also suggested in this study to improve the sensitivity in DNA detection by using I-V measurements through multilayer gold nanoparticle structures.

原文英語
頁(從 - 到)546-555
頁數10
期刊Microelectronic Engineering
78-79
發行號1-4
DOIs
出版狀態已發佈 - 2005 三月
事件Proceedings of the 30th International Conference on Micro- and Nano-Engineering -
持續時間: 2004 九月 192004 九月 22

ASJC Scopus subject areas

  • 電子、光磁材料
  • 原子與分子物理與光學
  • 凝聚態物理學
  • 表面、塗料和薄膜
  • 電氣與電子工程

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