TY - GEN
T1 - A study to performance of electroplating solder bump in assembly
AU - Wang, Mu Chun
AU - Huang, Kuo Shu
AU - Hsieh, Zhen Ying
AU - Yang, Hsin Chia
AU - Liu, Chuan Hsi
AU - Lin, Chii Ruey
PY - 2010
Y1 - 2010
N2 - The electroplating methodology in assembly is better than the stencil printing manufacturing in pre-WLCSP (wafer-level chip-scale packaging), especially in quality. Through eightstep process requiring one photolithographic mask, the pre-WLCSP procedures for the electroplating solder bump technology are able to be completed. Comparing this technology with the electroplating gold bump technology, the cost in the previous is more impressive even though the performance of this technology is little lower than the last. Therefore, in this study, the electroplating solder bump in assembly was probed in detail to analyze the possibility of mass-production.
AB - The electroplating methodology in assembly is better than the stencil printing manufacturing in pre-WLCSP (wafer-level chip-scale packaging), especially in quality. Through eightstep process requiring one photolithographic mask, the pre-WLCSP procedures for the electroplating solder bump technology are able to be completed. Comparing this technology with the electroplating gold bump technology, the cost in the previous is more impressive even though the performance of this technology is little lower than the last. Therefore, in this study, the electroplating solder bump in assembly was probed in detail to analyze the possibility of mass-production.
UR - http://www.scopus.com/inward/record.url?scp=78449301225&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=78449301225&partnerID=8YFLogxK
U2 - 10.1109/ICEPT.2010.5582692
DO - 10.1109/ICEPT.2010.5582692
M3 - Conference contribution
AN - SCOPUS:78449301225
SN - 9781424481422
T3 - Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
SP - 794
EP - 797
BT - Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
T2 - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010
Y2 - 16 August 2010 through 19 August 2010
ER -