TY - GEN
T1 - A study of characteristics of halogen-free prevented solder materials
AU - Wang, Mu Chun
AU - Shih, Tien Tsorng
AU - Lin, Bao Yi
AU - Yang, Hsin Chia
AU - Wu, Yaw Dong
AU - Liu, Chuan Hsi
PY - 2012
Y1 - 2012
N2 - Green electronic products are more preferred in the recent era, especially in lead-free and halogen-free manufactures. A brand-new halogen-free solder resist, AUS320, provides the good performance, compared with the popular low-halogen AUS308 such as in halogen concentration, flatness on cavity surface and roughness on cross-section as well as the optical and thermal reactions.
AB - Green electronic products are more preferred in the recent era, especially in lead-free and halogen-free manufactures. A brand-new halogen-free solder resist, AUS320, provides the good performance, compared with the popular low-halogen AUS308 such as in halogen concentration, flatness on cavity surface and roughness on cross-section as well as the optical and thermal reactions.
UR - http://www.scopus.com/inward/record.url?scp=84875437542&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84875437542&partnerID=8YFLogxK
U2 - 10.1109/ICEPT-HDP.2012.6474579
DO - 10.1109/ICEPT-HDP.2012.6474579
M3 - Conference contribution
AN - SCOPUS:84875437542
SN - 9781467316804
T3 - ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging
SP - 101
EP - 104
BT - ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging
T2 - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012
Y2 - 13 August 2012 through 16 August 2012
ER -