TY - GEN
T1 - A Proposal of Hardware Channel Bonding for IEEE802.11N Wireless Network Using Raspberry PI
AU - Sudibyo, Rahardhita Widyatra
AU - Funabiki, Nobuo
AU - Kao, Wen Chung
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/8/27
Y1 - 2018/8/27
N2 - Raspberry Pi has become popular around the world as a small-size, low-cost, low-power, and high-performance computing device. It can be used as a software access-point for IEEE802.11n wireless local-area networks. Unfortunately, only the software channel bonding is available where two independent 20MHz channels are used together for each link. In this paper, we present the configuration of Raspberry Pi for the hardware channel bonding to increase the capacity with 40MHz bandwidth. Because the built-in wireless NIC does not support it, the external adapter with USB3.0 is used together. To verify the performance, we conducted throughput measurements in two scenarios.
AB - Raspberry Pi has become popular around the world as a small-size, low-cost, low-power, and high-performance computing device. It can be used as a software access-point for IEEE802.11n wireless local-area networks. Unfortunately, only the software channel bonding is available where two independent 20MHz channels are used together for each link. In this paper, we present the configuration of Raspberry Pi for the hardware channel bonding to increase the capacity with 40MHz bandwidth. Because the built-in wireless NIC does not support it, the external adapter with USB3.0 is used together. To verify the performance, we conducted throughput measurements in two scenarios.
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U2 - 10.1109/ICCE-China.2018.8448498
DO - 10.1109/ICCE-China.2018.8448498
M3 - Conference contribution
AN - SCOPUS:85053900401
SN - 9781538663011
T3 - 2018 IEEE International Conference on Consumer Electronics-Taiwan, ICCE-TW 2018
BT - 2018 IEEE International Conference on Consumer Electronics-Taiwan, ICCE-TW 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 5th IEEE International Conference on Consumer Electronics-Taiwan, ICCE-TW 2018
Y2 - 19 May 2018 through 21 May 2018
ER -