A non-fluorine mold release agent for Ni stamp in nanoimprint process

Tien Li Chang*, Jung Chang Wang, Chun Chi Chen, Ya Wei Lee, Ta Hsin Chou

*此作品的通信作者

研究成果: 雜誌貢獻期刊論文同行評審

10 引文 斯高帕斯(Scopus)

摘要

This study presents a novel material as an anti-adhesive layer between Ni mold stamps and polymethyl methacrylate (PMMA) substrate in nanoimprint process. A polybenzoxazine ((6,6'-bis(2,3-dihydro-3-methyl-4H-1,3-benzoxazinyl))) molecule self-assembled monolayer (PBO-SAM) considering as anti-adhesive coating agent demonstrates that non-fluorine-containing compounds can be improve the nanoimprint process in Ni/PMMA substrates. In this work, the nanostructure-based Ni stamps and the imprinted PMMA mold are performed by electron-beam lithograph (EBL) and our homemade nanoimprint equipment, respectively. To control the forming of fabricated nanopatterns, the simulation can be analyzed their effect of temperature distributions on the deformation of PBO-SAM/PMMA substrate during hot embossing lithography (HEL) process. Herein the diameter of pillar patterns is 200 nm with and 400 nm pitch on Ni stamp surface. Based on the hydrophobic PBO-SAM surface in this conforming condition, the results of Ni mold stamps infer over 90% improvement in controlling quality and quantity.

原文英語
頁(從 - 到)1608-1612
頁數5
期刊Microelectronic Engineering
85
發行號7
DOIs
出版狀態已發佈 - 2008 七月 1
對外發佈

ASJC Scopus subject areas

  • 電子、光磁材料
  • 原子與分子物理與光學
  • 凝聚態物理學
  • 表面、塗料和薄膜
  • 電氣與電子工程

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