A bond graph representation of p-n junction diode using VHDL-AMS

Chung Chieh Lin, Chin-Ming Hong

研究成果: 書貢獻/報告類型會議貢獻

2 引文 斯高帕斯(Scopus)

摘要

This study focuses on the p-n junction diode modeling and simulation using bond graphs and VHDL-AMS. The bond graph modeling technique has been given an accommodated model for the interaction of power between elements on a system. The power flow is briefly sketched in the bond graph and the state equations are formulated directly from this graphical representation. Bond graph modeling is largely employed nowadays, and new techniques for structural analysis, model reduction as well as a certain number of software packages using bond graph have been developed. The bond graph methodology is a way to get a p-n junction diode model with important parameters to know the performance. VHDL is a modeling language which dedicates the discrete description to digital electronic hardware. Its extension VHDL-AMS allows modeling analogue subsystems and describing signal flow on a functional level. VHDL-AMS can be used as a unified modeling language for combined discrete-continuous system simulation. Once bond graphs are established, they can be easily described in VHDL-AMS. It will be possible to implement those models in any VHDL-AMS simulator. The system modeling yields equations, i.e. algebra and differential equations, and these equations have to be implemented into a reference simulator. The model is developed and simulated with the VHDL-AMS language under Dolphin SMASH environment.

原文英語
主出版物標題Proceedings of the 2012 - 10th International Conference on Bond Graph Modeling and Simulation, ICBGM'12, Part of SummerSim 2012 Multiconference
頁面222-229
頁數8
版本13
出版狀態已發佈 - 2012 十一月 27
事件10th International Conference on Bond Graph Modeling and Simulation, ICBGM 2012, Part of SummerSim 2012 Multiconference - Genoa, 意大利
持續時間: 2012 七月 82012 七月 11

出版系列

名字Proceedings of the 2012 - 10th International Conference on Bond Graph Modeling and Simulation, ICBGM'12, Part of SummerSim 2012 Multiconference
號碼13
44

其他

其他10th International Conference on Bond Graph Modeling and Simulation, ICBGM 2012, Part of SummerSim 2012 Multiconference
國家意大利
城市Genoa
期間2012/07/082012/07/11

ASJC Scopus subject areas

  • Modelling and Simulation

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