300 GHz On-Chip Horn Antenna with WR-03 to SIW Transition Using Integrated Passive Device

Wei Hung Chen, Tzyh Ghuang Ma, Jeng Han Tsai, Yu Hsiang Cheng

研究成果: 書貢獻/報告類型會議論文篇章

摘要

In this paper, an on-chip H-plane horn antenna operating at 300 GHz is proposed and simulated. The antenna is realized on the integrated passive device (IPD) process, fed from a WR03-to-substrate integrated waveguide (SIW) transition. The transition comprises a stepped waveguide section, a coupling aperture, and a substrate integrated waveguide section. The integrated passive device (IPD) process selects the intrinsic Gallium arsenide (GaAs) as the carrier substrate. The chip is integrated with an aluminum split-block for measurement purpose using a standard WR-03 waveguide. The simulated Sparameter reveals a reflection coefficient of -12.4 dB at 300 GHz. The antenna achieves a realized gain of 6.4 dBi and a radiation efficiency of 62%. The aluminum housing significantly suppresses the broadside/back radiation and fulfills the desired end-fire pattern with front to back ratio of 11.5 dB.

原文英語
主出版物標題2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, AP-S/URSI 2023 - Proceedings
發行者Institute of Electrical and Electronics Engineers Inc.
頁面429-430
頁數2
ISBN(電子)9781665442282
DOIs
出版狀態已發佈 - 2023
事件2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, AP-S/URSI 2023 - Portland, 美国
持續時間: 2023 7月 232023 7月 28

出版系列

名字IEEE Antennas and Propagation Society, AP-S International Symposium (Digest)
2023-July
ISSN(列印)1522-3965

會議

會議2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting, AP-S/URSI 2023
國家/地區美国
城市Portland
期間2023/07/232023/07/28

ASJC Scopus subject areas

  • 電氣與電子工程

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