高精密複合式設備系統開發與高密度超高細長比精微陣列式3D-IC探針製作技術研究

The project incorporates two important phases: a low-cost, high-precision hybrid fabrication system is developed in first year and then the developed fabrication system is employed in fast on-line forming of micro 3D-IC probe array with fine pitch and high slenderness ratio in second year. A high-frequency vibration assisted technique that the micro wire is vibrated radially with micro scale via a piezoelectric ceramic material is proposed to assist in the removal of debris and reduce the frequencies of secondary discharge and short. In addition, a multi-micro-wire-cut electrical discharge machining technique in which combines micro wire array with the developed plural resistance-capacitances (PRC) electrical discharge machining technique to realize dispersion discharge is proposed in the study. Experimental results demonstrate that the proposed approach can fabricate high-spatial-density and ultra-high-aspect-ratio micro structure with 10x10 squared probes. The finished probe array that have the dimensions of 23×23×2,500μm and the aspect ratio of over 100 is qualified to detect the micro structural circuit, 3D-IC especially. In addition, the time is about four-fifth of the machining time for without high-frequency vibration assisted. The machining efficiency is greatly improved and achieve a high -speed and -accuracy micro w-EDM approach. These experimental results will be of substantial benefit to precision machining.