專案詳細資料
說明
An innovative method was designed to measure silicon nanowire arrays thermal conductivity, which is the one of important properties of thermoelectric device. Furthermore, simulation analysis by software was used to verify the accuracy of measuring data. To build a single silicon nanowire model to measure the thermal conductivity of silicon nanowire arrays, ANSYS Icepak 14.0 software and Fourier’s law of thermal conduction have been utilized in this study. The results of xy and z direction of thermal conductivity of single silicon nanowire model were simulated and calculated. Next, we utilized axial heat flow method to measure the thermal conductivity of polymer and the interface thermal resistance of Si/polymer. Finally, a sample of silicon nanowires array with three metal wires has been made to simulate and measure the thermal conductivity of silicon nanowires structure, which is about 90 ~ 120 . This result confirms that the thermal conductivity of silicon nanowire arrays is lower than silicon bulk’s.
| 狀態 | 已完成 |
|---|---|
| 有效的開始/結束日期 | 2013/01/01 → 2013/12/31 |
Keywords
- 矽奈米線
- 熱電應用
- 熱傳導係數
- 金屬輔助無電蝕刻
指紋
探索此專案觸及的研究主題。這些標籤是根據基礎獎勵/補助款而產生。共同形成了獨特的指紋。