TY - GEN
T1 - Vertical SCR structure for on-chip ESD protection in nanoscale CMOS technology
AU - Lin, Chun Yu
AU - Chang, Pin Hsin
AU - Chang, Rong Kun
AU - Ker, Ming Dou
AU - Wang, Wen Tai
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/8/25
Y1 - 2015/8/25
N2 - A vertical silicon-controlled rectifier (SCR) structure utilizing ESD implantation layer was proposed and implemented in nanoscale CMOS technology. Compared with the traditional SCR structure, the proposed structure has lower trigger voltage and high enough ESD protection capability. Therefore, the proposed structure was suitable for ESD protection in nanoscale CMOS process.
AB - A vertical silicon-controlled rectifier (SCR) structure utilizing ESD implantation layer was proposed and implemented in nanoscale CMOS technology. Compared with the traditional SCR structure, the proposed structure has lower trigger voltage and high enough ESD protection capability. Therefore, the proposed structure was suitable for ESD protection in nanoscale CMOS process.
UR - http://www.scopus.com/inward/record.url?scp=84949811797&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84949811797&partnerID=8YFLogxK
U2 - 10.1109/IPFA.2015.7224380
DO - 10.1109/IPFA.2015.7224380
M3 - Conference contribution
AN - SCOPUS:84949811797
T3 - Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
SP - 255
EP - 258
BT - Proceedings of the 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015
Y2 - 29 June 2015 through 2 July 2015
ER -