Using nanoindentation to investigate the temperature cycling of Sn–37Pb solders

Hua Chiang Wen, Wu Ching Chou, Po Chen Lin, Yeau Ren Jeng, Chien Chang Chen, Hung Ming Chen, Don Son Jiang, Chun Hu Cheng

Research output: Contribution to journalArticle

Abstract

Using nanoindentation and energy dispersive X-ray spectrometry (EDS), we have conducted an investigation into corner failures to elucidate not only the nanomechanical properties of Sn–37Pb solder balls but also the effects of temperature cycling tests (TCTs). We found that the hardness of Sn–37Pb solder balls was greater in central locations [1.18 ± 0.05 GPa for room-temperature (RT) sample; 1.3 ± 0.05 GPa for TCT sample], but had standard values in corner locations (> 0.2 ± 0.02 GPa). The modulus increased after the TCTs. Nevertheless, the mechanical properties were closely related to the average area of the α-Pb phase. The average area of the Pb-rich region was more stable after the TCTs than that of the RT sample, due to the enhanced mechanical properties of the Sn–37Pb solder, suggesting good reliability. From an analysis of average areas in the RT sample, it appears that the Pb-rich solid solution that formed led to weak Sn–Pb bonds near the corner locations. Electron back-scattered diffraction measurements revealed that grains with grain boundaries formed as a result of accelerated TCT cycling. We conclude that Sn–Pb recrystallization was initiated and propagated after the TCTs, followed by propagation to the interfacial region.

Original languageEnglish
Pages (from-to)111-117
Number of pages7
JournalMicroelectronics Reliability
Volume78
DOIs
Publication statusPublished - 2017 Nov

Fingerprint

Nanoindentation
solders
nanoindentation
Soldering alloys
cycles
Temperature
temperature
balls
room temperature
mechanical properties
Mechanical properties
x ray spectroscopy
solid solutions
hardness
grain boundaries
Energy dispersive spectroscopy
Solid solutions
Grain boundaries
Diffraction
propagation

Keywords

  • Diffusion
  • Electron microscopy
  • Intermetallic compounds
  • Recrystallization

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Safety, Risk, Reliability and Quality
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

Cite this

Using nanoindentation to investigate the temperature cycling of Sn–37Pb solders. / Wen, Hua Chiang; Chou, Wu Ching; Lin, Po Chen; Jeng, Yeau Ren; Chen, Chien Chang; Chen, Hung Ming; Jiang, Don Son; Cheng, Chun Hu.

In: Microelectronics Reliability, Vol. 78, 11.2017, p. 111-117.

Research output: Contribution to journalArticle

Wen, Hua Chiang ; Chou, Wu Ching ; Lin, Po Chen ; Jeng, Yeau Ren ; Chen, Chien Chang ; Chen, Hung Ming ; Jiang, Don Son ; Cheng, Chun Hu. / Using nanoindentation to investigate the temperature cycling of Sn–37Pb solders. In: Microelectronics Reliability. 2017 ; Vol. 78. pp. 111-117.
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