Using finite element method software to enhance teaching about copper pillar bump flip-chip packaging

Yunn Horng Guu, Lung Sheng Lee, Ming Zheng Huang

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

This study uses Finite Element Method (FEM) software to analyse the mechanical behaviour of copper pillar bump flip-chip packaging when subjected to temperature loading. The major advantages of FEM software are that they can simulate the robustness and performance of components and assemblies, as well as enable mechanical engineering students to understand the details of the planning, design and analysis of packaging better. The proposed simulation analysis of the flip-chip packaging is suitable for the courses related to Computer-Aided Engineering (CAE) and electronic packages for junior and senior university students.

Original languageEnglish
Pages (from-to)178-183
Number of pages6
JournalWorld Transactions on Engineering and Technology Education
Volume9
Issue number3
Publication statusPublished - 2011
Externally publishedYes

Fingerprint

Packaging
Teaching
Copper
Finite element method
mechanical engineering
Students
student
Computer aided engineering
electronics
Mechanical engineering
engineering
simulation
planning
university
performance
Planning
software
Temperature

ASJC Scopus subject areas

  • Education
  • Engineering(all)

Cite this

Using finite element method software to enhance teaching about copper pillar bump flip-chip packaging. / Guu, Yunn Horng; Lee, Lung Sheng; Huang, Ming Zheng.

In: World Transactions on Engineering and Technology Education, Vol. 9, No. 3, 2011, p. 178-183.

Research output: Contribution to journalArticle

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