This study uses Finite Element Method (FEM) software to analyse the mechanical behaviour of copper pillar bump flip-chip packaging when subjected to temperature loading. The major advantages of FEM software are that they can simulate the robustness and performance of components and assemblies, as well as enable mechanical engineering students to understand the details of the planning, design and analysis of packaging better. The proposed simulation analysis of the flip-chip packaging is suitable for the courses related to Computer-Aided Engineering (CAE) and electronic packages for junior and senior university students.
|Number of pages||6|
|Journal||World Transactions on Engineering and Technology Education|
|Publication status||Published - 2011 Dec 1|
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