Ultra-high-vacuum chemical vapor deposition of hetero-epitaxial Si 1-x-yGexCy thin films on Si(0 0 1) with ethylene (C2H4) precursor as carbon source

P. S. Chen, S. W. Lee, Y. H. Liu, M. H. Lee, M. J. Tsai, C. W. Liu

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8 Citations (Scopus)

Abstract

The incorporation of substitutional carbon (Csub) in low-temperature epitaxial Si1-x-yGexCy thin films using SiH4, GeH4 and C2H4 by ultra-high-vacuum chemical vapor deposition was investigated in this work. The Si1-x-yGexCy alloys have been grown at a temperature range from 550 to 600 °C. The Csub content in Si 1-x-yGexCy increases with increasing C 2H4 partial pressure under the same SiH4 and GeH4 condition. The addition of excessive C2H4 causes the degradation of Si1-x-yGexCy crystallinity, surface roughening and the suppression of Ge incorporation. The C-C double bonds in C2H4 were responsible for the highest percentage of Csub, only 0.2%, incorporated in Si 0.8-yGe0.2Cy. The Ge, B and C concentration were determined by secondary ion mass spectroscopy (SIMS). The total C atoms incorporation efficiency is ∼0.05. The maximum concentration of C sub in Si1-x-yGexCy increases with the decrease of Ge content. In the ambient of hydride-based CVD at low-growth pressure and temperature, the presence of GeH4 would impede the incorporation of Csub in Si1-x-yGexC y/Si heterostructure using C2H4 as C source.

Original languageEnglish
Pages (from-to)15-19
Number of pages5
JournalMaterials Science in Semiconductor Processing
Volume8
Issue number1-3 SPEC. ISS.
DOIs
Publication statusPublished - 2005 Feb 1

Keywords

  • Carbon
  • Ethylene
  • Germanium
  • Silicon
  • UHV/CVD

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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