TY - GEN
T1 - Through Glass Via Detection and Inspection by Holographic Optical Metrology
AU - Huang, Chung Hsuan
AU - Cheng, Chau Jern
N1 - Publisher Copyright:
© 2025 SPIE.
PY - 2025
Y1 - 2025
N2 - This study proposes an in-situ, full-field detection and inspection of through glass vias (TGVs) using digital holography (DH). DH reconstructs the complete three-dimensional morphology of the vias using digital hologram recorded in an image sensor. The proposed holographic optical metrology (HOM) method allows for the quantitative analysis of various physical parameters of high-aspect-ratio TGVs, including diameter, thickness, waist width, center deviation, roughness, and sidewall profile. By employing numerical optimization algorithm and calculation process, the proposed method can identify abnormal via positions and achieve high-speed, high-throughput TGVs detection and inspection. This non-contact, high-speed optical inspection technique will improve the efficiency and accuracy of TGV quality control, thereby may enhance the yield and reliability of advanced packaging processes.
AB - This study proposes an in-situ, full-field detection and inspection of through glass vias (TGVs) using digital holography (DH). DH reconstructs the complete three-dimensional morphology of the vias using digital hologram recorded in an image sensor. The proposed holographic optical metrology (HOM) method allows for the quantitative analysis of various physical parameters of high-aspect-ratio TGVs, including diameter, thickness, waist width, center deviation, roughness, and sidewall profile. By employing numerical optimization algorithm and calculation process, the proposed method can identify abnormal via positions and achieve high-speed, high-throughput TGVs detection and inspection. This non-contact, high-speed optical inspection technique will improve the efficiency and accuracy of TGV quality control, thereby may enhance the yield and reliability of advanced packaging processes.
KW - defect inspection
KW - digital holography
KW - holographic optical metrology
KW - through glass vias
UR - https://www.scopus.com/pages/publications/105007139368
UR - https://www.scopus.com/pages/publications/105007139368#tab=citedBy
U2 - 10.1117/12.3051287
DO - 10.1117/12.3051287
M3 - Conference contribution
AN - SCOPUS:105007139368
T3 - Proceedings of SPIE - The International Society for Optical Engineering
BT - Metrology, Inspection, and Process Control XXXIX
A2 - Sendelbach, Matthew J.
A2 - Schuch, Nivea G.
PB - SPIE
T2 - Metrology, Inspection, and Process Control XXXIX 2025
Y2 - 24 February 2025 through 28 February 2025
ER -