Thermal conductivity of thermoelectric thick films prepared by electrodeposition

Heng Chieh Chien, Chii Rong Yang, Li Ling Liao, Chun Kai Liu, Ming Ji Dai, Ra Min Tain, Da Jeng Yao

Research output: Contribution to journalArticle

8 Citations (Scopus)

Abstract

Because of a lack of appropriate methods and the difficulties of sample preparation, few direct measurements of the thermal conductivity of thermoelectric materials in thin films have been reported. We prepared thermoelectric thin films of four types containing Bi-Te and Sb-Te by electrodeposition from aqueous solutions with and without added surfactant, and evaluated their intrinsic thermal conductivity with a modified parallel-strip technique. Three thermoelectric materials showed values 0.2-0.5 W m-1 K-1 of intrinsic thermal conductivity; for the other type problems of sample preparation precluded measurement. According to observations with a scanning electron microscope, the existence of grain boundaries in the thermoelectric thin films is likely the cause of the small values, and their fragile structure causes difficulty in preparation of a test sample.

Original languageEnglish
Pages (from-to)75-83
Number of pages9
JournalApplied Thermal Engineering
Volume51
Issue number1-2
DOIs
Publication statusPublished - 2013 Jan 1

    Fingerprint

Keywords

  • Electrodeposition
  • Measurement
  • Thermal conductivity
  • Thermoelectric
  • Thick film

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Industrial and Manufacturing Engineering

Cite this