Thermal conductivity of thermoelectric thick films prepared by electrodeposition

Heng Chieh Chien, Chii Rong Yang, Li Ling Liao, Chun Kai Liu, Ming Ji Dai, Ra Min Tain, Da Jeng Yao

Research output: Contribution to journalArticle

8 Citations (Scopus)

Abstract

Because of a lack of appropriate methods and the difficulties of sample preparation, few direct measurements of the thermal conductivity of thermoelectric materials in thin films have been reported. We prepared thermoelectric thin films of four types containing Bi-Te and Sb-Te by electrodeposition from aqueous solutions with and without added surfactant, and evaluated their intrinsic thermal conductivity with a modified parallel-strip technique. Three thermoelectric materials showed values 0.2-0.5 W m-1 K-1 of intrinsic thermal conductivity; for the other type problems of sample preparation precluded measurement. According to observations with a scanning electron microscope, the existence of grain boundaries in the thermoelectric thin films is likely the cause of the small values, and their fragile structure causes difficulty in preparation of a test sample.

Original languageEnglish
Pages (from-to)75-83
Number of pages9
JournalApplied Thermal Engineering
Volume51
Issue number1-2
DOIs
Publication statusPublished - 2013 Jan 1

Fingerprint

Thick films
Electrodeposition
Thermal conductivity
Thin films
Grain boundaries
Surface active agents
Electron microscopes
Scanning

Keywords

  • Electrodeposition
  • Measurement
  • Thermal conductivity
  • Thermoelectric
  • Thick film

ASJC Scopus subject areas

  • Energy Engineering and Power Technology
  • Industrial and Manufacturing Engineering

Cite this

Thermal conductivity of thermoelectric thick films prepared by electrodeposition. / Chien, Heng Chieh; Yang, Chii Rong; Liao, Li Ling; Liu, Chun Kai; Dai, Ming Ji; Tain, Ra Min; Yao, Da Jeng.

In: Applied Thermal Engineering, Vol. 51, No. 1-2, 01.01.2013, p. 75-83.

Research output: Contribution to journalArticle

Chien, Heng Chieh ; Yang, Chii Rong ; Liao, Li Ling ; Liu, Chun Kai ; Dai, Ming Ji ; Tain, Ra Min ; Yao, Da Jeng. / Thermal conductivity of thermoelectric thick films prepared by electrodeposition. In: Applied Thermal Engineering. 2013 ; Vol. 51, No. 1-2. pp. 75-83.
@article{fbb655421ca749e4841d09c0d00e3328,
title = "Thermal conductivity of thermoelectric thick films prepared by electrodeposition",
abstract = "Because of a lack of appropriate methods and the difficulties of sample preparation, few direct measurements of the thermal conductivity of thermoelectric materials in thin films have been reported. We prepared thermoelectric thin films of four types containing Bi-Te and Sb-Te by electrodeposition from aqueous solutions with and without added surfactant, and evaluated their intrinsic thermal conductivity with a modified parallel-strip technique. Three thermoelectric materials showed values 0.2-0.5 W m-1 K-1 of intrinsic thermal conductivity; for the other type problems of sample preparation precluded measurement. According to observations with a scanning electron microscope, the existence of grain boundaries in the thermoelectric thin films is likely the cause of the small values, and their fragile structure causes difficulty in preparation of a test sample.",
keywords = "Electrodeposition, Measurement, Thermal conductivity, Thermoelectric, Thick film",
author = "Chien, {Heng Chieh} and Yang, {Chii Rong} and Liao, {Li Ling} and Liu, {Chun Kai} and Dai, {Ming Ji} and Tain, {Ra Min} and Yao, {Da Jeng}",
year = "2013",
month = "1",
day = "1",
doi = "10.1016/j.applthermaleng.2012.09.004",
language = "English",
volume = "51",
pages = "75--83",
journal = "Applied Thermal Engineering",
issn = "1359-4311",
publisher = "Elsevier Limited",
number = "1-2",

}

TY - JOUR

T1 - Thermal conductivity of thermoelectric thick films prepared by electrodeposition

AU - Chien, Heng Chieh

AU - Yang, Chii Rong

AU - Liao, Li Ling

AU - Liu, Chun Kai

AU - Dai, Ming Ji

AU - Tain, Ra Min

AU - Yao, Da Jeng

PY - 2013/1/1

Y1 - 2013/1/1

N2 - Because of a lack of appropriate methods and the difficulties of sample preparation, few direct measurements of the thermal conductivity of thermoelectric materials in thin films have been reported. We prepared thermoelectric thin films of four types containing Bi-Te and Sb-Te by electrodeposition from aqueous solutions with and without added surfactant, and evaluated their intrinsic thermal conductivity with a modified parallel-strip technique. Three thermoelectric materials showed values 0.2-0.5 W m-1 K-1 of intrinsic thermal conductivity; for the other type problems of sample preparation precluded measurement. According to observations with a scanning electron microscope, the existence of grain boundaries in the thermoelectric thin films is likely the cause of the small values, and their fragile structure causes difficulty in preparation of a test sample.

AB - Because of a lack of appropriate methods and the difficulties of sample preparation, few direct measurements of the thermal conductivity of thermoelectric materials in thin films have been reported. We prepared thermoelectric thin films of four types containing Bi-Te and Sb-Te by electrodeposition from aqueous solutions with and without added surfactant, and evaluated their intrinsic thermal conductivity with a modified parallel-strip technique. Three thermoelectric materials showed values 0.2-0.5 W m-1 K-1 of intrinsic thermal conductivity; for the other type problems of sample preparation precluded measurement. According to observations with a scanning electron microscope, the existence of grain boundaries in the thermoelectric thin films is likely the cause of the small values, and their fragile structure causes difficulty in preparation of a test sample.

KW - Electrodeposition

KW - Measurement

KW - Thermal conductivity

KW - Thermoelectric

KW - Thick film

UR - http://www.scopus.com/inward/record.url?scp=84867441483&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84867441483&partnerID=8YFLogxK

U2 - 10.1016/j.applthermaleng.2012.09.004

DO - 10.1016/j.applthermaleng.2012.09.004

M3 - Article

AN - SCOPUS:84867441483

VL - 51

SP - 75

EP - 83

JO - Applied Thermal Engineering

JF - Applied Thermal Engineering

SN - 1359-4311

IS - 1-2

ER -