TY - GEN
T1 - Thermal conductivity of thermoelectric thick films deposited by an electrodeposition process
AU - Chien, Heng Chieh
AU - Yang, Chii Rong
AU - Liao, Li Ling
AU - Yao, Da Jeng
AU - Liu, Chun Kai
AU - Dai, Ming Ji
AU - Tain, Ra Min
PY - 2010
Y1 - 2010
N2 - Due to the lack of advanced technology and difficulties in sample preparing, direct measurement of thermal conductivity for thin-film thermoelectric material is rarely reported in literatures. In this work, there are four types of thermoelectric thin films measured for their intrinsic thermal conductivity by using a modified parallel-strip technique. These four types of thermoelectric thin films are of Bi-Te and Sb-Te compositions, resulting from electrodeposition process with different aqueous solutions. From the measurement results, three types of the films shown quite low intrinsic thermal conductivity less than 0.5 Wm-1K-1; and one type of the films can not be measured due to sample preparing problem. According to the scanning electron microscope observations, the grain boundaries in the thermoelectric thin films are probably the cause that results in their low thermal conductivity and the fragile structure is the cause of difficulty for the sample preparation.
AB - Due to the lack of advanced technology and difficulties in sample preparing, direct measurement of thermal conductivity for thin-film thermoelectric material is rarely reported in literatures. In this work, there are four types of thermoelectric thin films measured for their intrinsic thermal conductivity by using a modified parallel-strip technique. These four types of thermoelectric thin films are of Bi-Te and Sb-Te compositions, resulting from electrodeposition process with different aqueous solutions. From the measurement results, three types of the films shown quite low intrinsic thermal conductivity less than 0.5 Wm-1K-1; and one type of the films can not be measured due to sample preparing problem. According to the scanning electron microscope observations, the grain boundaries in the thermoelectric thin films are probably the cause that results in their low thermal conductivity and the fragile structure is the cause of difficulty for the sample preparation.
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U2 - 10.1109/IMPACT.2010.5699616
DO - 10.1109/IMPACT.2010.5699616
M3 - Conference contribution
AN - SCOPUS:79951618196
SN - 9781424497836
T3 - International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings
BT - International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings
T2 - 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference
Y2 - 20 October 2010 through 22 October 2010
ER -