Thermal conductivity of thermoelectric thick films deposited by an electrodeposition process

Heng Chieh Chien, Chii Rong Yang, Li Ling Liao, Da Jeng Yao, Chun Kai Liu, Ming Ji Dai, Ra Min Tain

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Due to the lack of advanced technology and difficulties in sample preparing, direct measurement of thermal conductivity for thin-film thermoelectric material is rarely reported in literatures. In this work, there are four types of thermoelectric thin films measured for their intrinsic thermal conductivity by using a modified parallel-strip technique. These four types of thermoelectric thin films are of Bi-Te and Sb-Te compositions, resulting from electrodeposition process with different aqueous solutions. From the measurement results, three types of the films shown quite low intrinsic thermal conductivity less than 0.5 Wm-1K-1; and one type of the films can not be measured due to sample preparing problem. According to the scanning electron microscope observations, the grain boundaries in the thermoelectric thin films are probably the cause that results in their low thermal conductivity and the fragile structure is the cause of difficulty for the sample preparation.

Original languageEnglish
Title of host publicationInternational Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings
DOIs
Publication statusPublished - 2010 Dec 1
Event2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference - Taipei, Taiwan
Duration: 2010 Oct 202010 Oct 22

Other

Other2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference
CountryTaiwan
CityTaipei
Period10/10/2010/10/22

Fingerprint

Thick films
Electrodeposition
Thermal conductivity
Thin films
Grain boundaries
Electron microscopes
Scanning
Chemical analysis

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Chien, H. C., Yang, C. R., Liao, L. L., Yao, D. J., Liu, C. K., Dai, M. J., & Tain, R. M. (2010). Thermal conductivity of thermoelectric thick films deposited by an electrodeposition process. In International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings [5699616] https://doi.org/10.1109/IMPACT.2010.5699616

Thermal conductivity of thermoelectric thick films deposited by an electrodeposition process. / Chien, Heng Chieh; Yang, Chii Rong; Liao, Li Ling; Yao, Da Jeng; Liu, Chun Kai; Dai, Ming Ji; Tain, Ra Min.

International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings. 2010. 5699616.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Chien, HC, Yang, CR, Liao, LL, Yao, DJ, Liu, CK, Dai, MJ & Tain, RM 2010, Thermal conductivity of thermoelectric thick films deposited by an electrodeposition process. in International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings., 5699616, 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Taipei, Taiwan, 10/10/20. https://doi.org/10.1109/IMPACT.2010.5699616
Chien HC, Yang CR, Liao LL, Yao DJ, Liu CK, Dai MJ et al. Thermal conductivity of thermoelectric thick films deposited by an electrodeposition process. In International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings. 2010. 5699616 https://doi.org/10.1109/IMPACT.2010.5699616
Chien, Heng Chieh ; Yang, Chii Rong ; Liao, Li Ling ; Yao, Da Jeng ; Liu, Chun Kai ; Dai, Ming Ji ; Tain, Ra Min. / Thermal conductivity of thermoelectric thick films deposited by an electrodeposition process. International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings. 2010.
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