Thermal accumulation improvement for fabrication manufacturing of monolithic 3D integrated circuits

Y. T. Liu, Min-Hung Lee, H. T. Chen, C. F. Huang, C. Y. Peng, L. S. Lee, M. J. Kao

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    2 Citations (Scopus)

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    Chemical Compounds

    Engineering & Materials Science

    Physics & Astronomy