Thermal accumulation improvement for fabrication manufacturing of monolithic 3D integrated circuits
- Y. T. Liu*
- , M. H. Lee
- , H. T. Chen
- , C. F. Huang
- , C. Y. Peng
- , L. S. Lee
- , M. J. Kao
*Corresponding author for this work
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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