The influence of electromechanical stress on the stability of nanocrystalline silicon thin film transistors made on colorless polyimide foil

I. Chung Chiu, Jung Jie Huang, Yung Pei Chen, I. Chun Cheng*, Jian Z. Chen, Min Hung Lee

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Staggered bottom-gate hydrogenated nanocrystalline silicon (nc-Si:H) thin film transistors (TFTs) fabricated on flexible transparent polyimide substrates were investigated. The saturation electron field-effect mobility and electrical bias-stress stability of these TFTs were evaluated under applied tensile mechanical strain parallel to the source-drain direction. The mobilities increased accompanying with deteriorated electrical stabilities as the applied tensile strain increased. The power-law dependence between the threshold voltage shift and the gate-bias stressing time indicated that the instability was mainly caused by the state creation at the interface between nc-Si:H channel and gate dielectric.

Original languageEnglish
Title of host publicationThin Film Transistors 10, TFT 10
PublisherElectrochemical Society Inc.
Pages65-69
Number of pages5
Edition5
ISBN (Electronic)9781607681748
ISBN (Print)9781566778244
DOIs
Publication statusPublished - 2010

Publication series

NameECS Transactions
Number5
Volume33
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

ASJC Scopus subject areas

  • General Engineering

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