Abstract
The thermal stability of a multilayer structure of protection layer/Co90Fe10/Os (d nm)/Os20Mn80 has been studied as functions of annealing temperature (Tan) and thickness of Osmium (Os) layer. The insertion of a thin Os layer between the Co90Fe10/Os20Mn80 interface shows better thermal stability. No diffusion evidence was found for samples with d ≧ 0.3 nm as examined by Auger electron spectroscopy depth profile at different annealing temperatures up to 400 °C. These samples with Os layer showed the same magnetic behavior and the hysteresis loop with squareness (S) larger than 0.9 were observed before and after annealing.
| Original language | English |
|---|---|
| Pages (from-to) | e50-e52 |
| Journal | Journal of Magnetism and Magnetic Materials |
| Volume | 304 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 2006 Sept |
| Externally published | Yes |
Keywords
- CoFe/Os/IrMn
- CoFe/Os/OsMn
- Mn diffusion
- Os interlayer
- Thermal stability
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
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