The Design and Assembly of Surface-Micromachined Optical Switch for Optical Add/Drop Multiplexer Application

Yu Chen Lin, Jin Chern Chiou, Wei Ting Lin, Yung Jiun Lin, Shuen De Wu

Research output: Contribution to journalArticle

13 Citations (Scopus)


An assembly process including: flip-chip bonding, microelectromechanical (MEMS) structure release, and atomic layer deposition (ALD) is proposed to integrate a surface micromachined optical switch for optical add/drop multiplexer (OADM) applications. In the current optical switch designs, pre-stressed beams were used to pop up the micromirror and an electrode (substrate) under the beams was designed to perform ON/OFF function of the optical switch. In order to achieve desired popped-up angle for precise optical switching, a flip-chip bonding technique is applied to a mechanical stopper with an accurate joint height that can be used to constrain the movement of the micromirror. A conformal thin layer of dielectric material (AL2O 3) coated on the surfaces of device through an ALD coating process is used to improve vertical actuation force, as well as electrical isolation. Experiments indicate that the micromirrors fabricated by the present assembly process can achieve desired angle that meet the requirements of the proposed OADM configuration.

Original languageEnglish
Pages (from-to)261-267
Number of pages7
JournalIEEE Transactions on Advanced Packaging
Issue number3
Publication statusPublished - 2003 Aug 1



  • ALD
  • Flip-chip bonding
  • Micromirror
  • OADM
  • Optical switch

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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