The Demonstration of High-Quality Carbon Nanotubes as Through-Silicon Vias (TSVs) for Three-Dimensional Connection Stacking and Power-Via Technology

C. M. Yen, S. Y. Chang, K. C. Chen, Y. J. Feng, L. H. Chen, B. Z. Liao, M. H. Lee, S. C. Chen, M. H. Liao*

*Corresponding author for this work

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2 Citations (Scopus)

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Engineering & Materials Science

Chemical Compounds