The Demonstration of High-Quality Carbon Nanotubes as Through-Silicon Vias (TSVs) for Three-Dimensional Connection Stacking and Power-Via Technology

C. M. Yen, S. Y. Chang, K. C. Chen, Y. J. Feng, L. H. Chen, B. Z. Liao, M. H. Lee, S. C. Chen, M. H. Liao*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

6 Citations (Scopus)

Fingerprint

Dive into the research topics of 'The Demonstration of High-Quality Carbon Nanotubes as Through-Silicon Vias (TSVs) for Three-Dimensional Connection Stacking and Power-Via Technology'. Together they form a unique fingerprint.

Earth and Planetary Sciences

Chemistry

Chemical Engineering

INIS