The demonstration of carbon nanotubes (CNTs) as flip-chip connections in 3-D integrated circuits with an ultralow connection resistance

M. H. Liao*, P. Y. Lu, W. J. Su, S. C. Chen, H. T. Hung, C. R. Kao, W. C. Pu, C. C.A. Chen, M. H. Lee

*Corresponding author for this work

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