The demonstration of Carbon Nano-Tubes (CNTs) as a promising high Aspect Ratio (>25) through Silicon Vias (TSVs) material for the vertical connection in the high dense 3DICs

P. Y. Lu, C. M. Yen, S. Y. Chang, Y. J. Feng, C. Lien, C. W. Hu, C. W. Yao, M. H. Lee, M. H. Liao*

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

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