Test structure on SCR device in waffle layout for RF ESD protection

Ming Dou Ker; Chun Yu Lin

doi:10.1109/ICMTS.2007.374482

Test structure on SCR device in waffle layout for RF ESD protection

Ming Dou Ker^*, Chun Yu Lin

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

5 Citations (Scopus)

Abstract

With the highest ESD level in a smallest layout area, SCR device was used as effective on-chip ESD protection device in CMOS technology. In this paper, a waffle layout test structure of SCR is proposed to investigate the current spreading efficiency for ESD protection. The SCR in waffle layout structure has smaller parasitic capacitance under the same ESD robustness. With smaller parasitic capacitance, the degradation on RF circuit performance due to on-chip ESD protection device can be reduced. The proposed waffle SCR is suitable for on-chip ESD protection in RF applications.

Original language	English
Title of host publication	2007 IEEE International Conference on Microelectronic Test Structures, ICMTS - Conference Proceedings
Pages	196-199
Number of pages	4
DOIs	https://doi.org/10.1109/ICMTS.2007.374482
Publication status	Published - 2007
Externally published	Yes
Event	2007 IEEE International Conference on Microelectronic Test Structures, ICMTS '07 - Bunkyo-ku, Japan Duration: 2007 Mar 19 → 2007 Mar 22

Publication series

Name	IEEE International Conference on Microelectronic Test Structures

Other

Other	2007 IEEE International Conference on Microelectronic Test Structures, ICMTS '07
Country/Territory	Japan
City	Bunkyo-ku
Period	2007/03/19 → 2007/03/22

Keywords

Electrostatic discharges (ESD)
Radio-frequency integrated circuit (RF IC)
Silicon-controlled rectifier (SCR)

ASJC Scopus subject areas

Electrical and Electronic Engineering

Access to Document

10.1109/ICMTS.2007.374482

Cite this

Test structure on SCR device in waffle layout for RF ESD protection. / Ker, Ming Dou; Lin, Chun Yu.
2007 IEEE International Conference on Microelectronic Test Structures, ICMTS - Conference Proceedings. 2007. p. 196-199 4252432 (IEEE International Conference on Microelectronic Test Structures).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Ker, MD & Lin, CY 2007, Test structure on SCR device in waffle layout for RF ESD protection. in 2007 IEEE International Conference on Microelectronic Test Structures, ICMTS - Conference Proceedings., 4252432, IEEE International Conference on Microelectronic Test Structures, pp. 196-199, 2007 IEEE International Conference on Microelectronic Test Structures, ICMTS '07, Bunkyo-ku, Japan, 2007/03/19. https://doi.org/10.1109/ICMTS.2007.374482

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title = "Test structure on SCR device in waffle layout for RF ESD protection",

abstract = "With the highest ESD level in a smallest layout area, SCR device was used as effective on-chip ESD protection device in CMOS technology. In this paper, a waffle layout test structure of SCR is proposed to investigate the current spreading efficiency for ESD protection. The SCR in waffle layout structure has smaller parasitic capacitance under the same ESD robustness. With smaller parasitic capacitance, the degradation on RF circuit performance due to on-chip ESD protection device can be reduced. The proposed waffle SCR is suitable for on-chip ESD protection in RF applications.",

keywords = "Electrostatic discharges (ESD), Radio-frequency integrated circuit (RF IC), Silicon-controlled rectifier (SCR)",

author = "Ker, {Ming Dou} and Lin, {Chun Yu}",

year = "2007",

doi = "10.1109/ICMTS.2007.374482",

language = "English",

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series = "IEEE International Conference on Microelectronic Test Structures",

pages = "196--199",

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AB - With the highest ESD level in a smallest layout area, SCR device was used as effective on-chip ESD protection device in CMOS technology. In this paper, a waffle layout test structure of SCR is proposed to investigate the current spreading efficiency for ESD protection. The SCR in waffle layout structure has smaller parasitic capacitance under the same ESD robustness. With smaller parasitic capacitance, the degradation on RF circuit performance due to on-chip ESD protection device can be reduced. The proposed waffle SCR is suitable for on-chip ESD protection in RF applications.

KW - Electrostatic discharges (ESD)

KW - Radio-frequency integrated circuit (RF IC)

KW - Silicon-controlled rectifier (SCR)

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Test structure on SCR device in waffle layout for RF ESD protection

Abstract

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Keywords

ASJC Scopus subject areas

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