Abstract
The strained-Si:C long channel MOSFET on a relaxed SiGe buffer is demonstrated in this study. The extracted electron mobility showed an enhancement of ~40% with the incorporation of 0.25% carbon in strained-Si long channel NMOSFETs. However, no improvement was seen in the output characteristics of the strained-Si:C PMOSFET. The performance enhancement seen is less than the theoretical prediction for increasing carbon content; this is due to the high alloy scattering potential with carbon incorporation, high interface state density (Dit) at the oxide/strained-Si:C interface and interstitial carbon induced Coulomb scattering. However, increased amounts of C may result in degraded device performance. Therefore, a balance must be struck to minimize C-induced extra Coulomb and alloy scattering rates in the fabrication of these devices.
Original language | English |
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Pages (from-to) | 105-109 |
Number of pages | 5 |
Journal | Thin Solid Films |
Volume | 517 |
Issue number | 1 |
DOIs | |
Publication status | Published - 2008 Nov 3 |
Keywords
- Alloy scattering
- Carbon
- Interface state density
- Mobility
- SiGe buffer
- Strain
- Strained-Si:C
- Transmission electron microscopy
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Surfaces and Interfaces
- Surfaces, Coatings and Films
- Metals and Alloys
- Materials Chemistry