Studying the impact of carbon on device performance for strained-Si MOSFETs

M. H. Lee, S. T. Chang, C. Y. Peng, B. F. Hsieh, S. Maikap, S. H. Liao

    Research output: Contribution to journalArticlepeer-review

    2 Citations (Scopus)

    Abstract

    The strained-Si:C long channel MOSFET on a relaxed SiGe buffer is demonstrated in this study. The extracted electron mobility showed an enhancement of ~40% with the incorporation of 0.25% carbon in strained-Si long channel NMOSFETs. However, no improvement was seen in the output characteristics of the strained-Si:C PMOSFET. The performance enhancement seen is less than the theoretical prediction for increasing carbon content; this is due to the high alloy scattering potential with carbon incorporation, high interface state density (Dit) at the oxide/strained-Si:C interface and interstitial carbon induced Coulomb scattering. However, increased amounts of C may result in degraded device performance. Therefore, a balance must be struck to minimize C-induced extra Coulomb and alloy scattering rates in the fabrication of these devices.

    Original languageEnglish
    Pages (from-to)105-109
    Number of pages5
    JournalThin Solid Films
    Volume517
    Issue number1
    DOIs
    Publication statusPublished - 2008 Nov 3

    Keywords

    • Alloy scattering
    • Carbon
    • Interface state density
    • Mobility
    • SiGe buffer
    • Strain
    • Strained-Si:C
    • Transmission electron microscopy

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Surfaces and Interfaces
    • Surfaces, Coatings and Films
    • Metals and Alloys
    • Materials Chemistry

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