Abstract
The purpose of this study was to develop the on-machine measurement techniques so as to precisely fabricate micro intricate part using ultra-fine w-EDM. The measurement-assisted approach which employs an automatic optical inspection (AOI) is incorporated to ultra-fine w-EDM process to on-machine detect the machining error for next re-machining. The AOI acquires the image through a high resolution CCD device from the contour of the workpiece after roughing in order to further process and recognize the image for determining the residual. This facilitates the on-machine error detection and compensation re-machining. The micro workpiece and electrode are not repositioned during machining. A fabrication for a micro probe of 30-μm diameter is rapidly machined and verified successfully. Based on the proposed technique, on-machine measurement with AOI has been realized satisfactorily.
| Original language | English |
|---|---|
| Title of host publication | International Conference on Advances in Materials and Processing Technologies, AMPT2010 |
| Pages | 1255-1260 |
| Number of pages | 6 |
| DOIs | |
| Publication status | Published - 2010 Dec 1 |
| Event | International Conference on Advances in Materials and Processing Technologies, AMPT2010 - Paris, France Duration: 2010 Oct 24 → 2010 Oct 27 |
Publication series
| Name | AIP Conference Proceedings |
|---|---|
| Volume | 1315 |
| ISSN (Print) | 0094-243X |
| ISSN (Electronic) | 1551-7616 |
Other
| Other | International Conference on Advances in Materials and Processing Technologies, AMPT2010 |
|---|---|
| Country | France |
| City | Paris |
| Period | 10/10/24 → 10/10/27 |
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Keywords
- Automatic optical inspection (AOI)
- ultra-fine w-EDM
ASJC Scopus subject areas
- Physics and Astronomy(all)
Cite this
Study on ultra-fine w-EDM with on-machine measurement-assisted. / Chen, Shun-Tong; Yang, Hong Ye.
International Conference on Advances in Materials and Processing Technologies, AMPT2010. 2010. p. 1255-1260 (AIP Conference Proceedings; Vol. 1315).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Study on ultra-fine w-EDM with on-machine measurement-assisted
AU - Chen, Shun-Tong
AU - Yang, Hong Ye
PY - 2010/12/1
Y1 - 2010/12/1
N2 - The purpose of this study was to develop the on-machine measurement techniques so as to precisely fabricate micro intricate part using ultra-fine w-EDM. The measurement-assisted approach which employs an automatic optical inspection (AOI) is incorporated to ultra-fine w-EDM process to on-machine detect the machining error for next re-machining. The AOI acquires the image through a high resolution CCD device from the contour of the workpiece after roughing in order to further process and recognize the image for determining the residual. This facilitates the on-machine error detection and compensation re-machining. The micro workpiece and electrode are not repositioned during machining. A fabrication for a micro probe of 30-μm diameter is rapidly machined and verified successfully. Based on the proposed technique, on-machine measurement with AOI has been realized satisfactorily.
AB - The purpose of this study was to develop the on-machine measurement techniques so as to precisely fabricate micro intricate part using ultra-fine w-EDM. The measurement-assisted approach which employs an automatic optical inspection (AOI) is incorporated to ultra-fine w-EDM process to on-machine detect the machining error for next re-machining. The AOI acquires the image through a high resolution CCD device from the contour of the workpiece after roughing in order to further process and recognize the image for determining the residual. This facilitates the on-machine error detection and compensation re-machining. The micro workpiece and electrode are not repositioned during machining. A fabrication for a micro probe of 30-μm diameter is rapidly machined and verified successfully. Based on the proposed technique, on-machine measurement with AOI has been realized satisfactorily.
KW - Automatic optical inspection (AOI)
KW - ultra-fine w-EDM
UR - http://www.scopus.com/inward/record.url?scp=79952568367&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=79952568367&partnerID=8YFLogxK
U2 - 10.1063/1.3552355
DO - 10.1063/1.3552355
M3 - Conference contribution
AN - SCOPUS:79952568367
SN - 9780735408715
T3 - AIP Conference Proceedings
SP - 1255
EP - 1260
BT - International Conference on Advances in Materials and Processing Technologies, AMPT2010
ER -