Study on ultra-fine w-EDM with on-machine measurement-assisted

Shun-Tong Chen, Hong Ye Yang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The purpose of this study was to develop the on-machine measurement techniques so as to precisely fabricate micro intricate part using ultra-fine w-EDM. The measurement-assisted approach which employs an automatic optical inspection (AOI) is incorporated to ultra-fine w-EDM process to on-machine detect the machining error for next re-machining. The AOI acquires the image through a high resolution CCD device from the contour of the workpiece after roughing in order to further process and recognize the image for determining the residual. This facilitates the on-machine error detection and compensation re-machining. The micro workpiece and electrode are not repositioned during machining. A fabrication for a micro probe of 30-μm diameter is rapidly machined and verified successfully. Based on the proposed technique, on-machine measurement with AOI has been realized satisfactorily.

Original languageEnglish
Title of host publicationInternational Conference on Advances in Materials and Processing Technologies, AMPT2010
Pages1255-1260
Number of pages6
DOIs
Publication statusPublished - 2010 Dec 1
EventInternational Conference on Advances in Materials and Processing Technologies, AMPT2010 - Paris, France
Duration: 2010 Oct 242010 Oct 27

Publication series

NameAIP Conference Proceedings
Volume1315
ISSN (Print)0094-243X
ISSN (Electronic)1551-7616

Other

OtherInternational Conference on Advances in Materials and Processing Technologies, AMPT2010
CountryFrance
CityParis
Period10/10/2410/10/27

Keywords

  • Automatic optical inspection (AOI)
  • ultra-fine w-EDM

ASJC Scopus subject areas

  • Physics and Astronomy(all)

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