Strained-Si with carbon incorporation for MOSFET source/drain engineering

M. H. Lee; S. T. Chang; S. W. Lee; P. S. Chen; K. W. Shen; W. C. Wang

doi:10.1016/j.apsusc.2008.02.179

Strained-Si with carbon incorporation for MOSFET source/drain engineering

M. H. Lee^*
, S. T. Chang
, S. W. Lee
, P. S. Chen
, K. W. Shen
, W. C. Wang

^*Corresponding author for this work

Undergraduate Program of Electro-Optical Engineering

Research output: Contribution to journal › Article › peer-review

3 Citations (Scopus)

Abstract

The carbon incorporation in strained-Si source/drain of MOSFET is demonstrated. The methylsilane (CH ₃ SiH ₃ ) is chosen as the carbon precursor to make high percentage of substitutional carbon, and less defects by interstitials and vacancies. The large D _it at oxide/strained-Si:C interface degrades the expected carrier mobility enhancement, but improvement is observed after forming gas annealing. The strained-Si source/drain with carbon incorporation is not only being stressor but also lower R _s , and make a potential candidate for future high-speed ballistic devices beyond 10 nm technology node.

Original language	English
Pages (from-to)	6147-6150
Number of pages	4
Journal	Applied Surface Science
Volume	254
Issue number	19
DOIs	https://doi.org/10.1016/j.apsusc.2008.02.179
Publication status	Published - 2008 Jul 30

Keywords

Methysilane
Strain
Strained-Si:C

ASJC Scopus subject areas

Condensed Matter Physics
Surfaces and Interfaces
Surfaces, Coatings and Films

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10.1016/j.apsusc.2008.02.179

Cite this

@article{0f9e5810cac14ffca110eb178c9998ca,

title = "Strained-Si with carbon incorporation for MOSFET source/drain engineering",

abstract = " The carbon incorporation in strained-Si source/drain of MOSFET is demonstrated. The methylsilane (CH 3 SiH 3 ) is chosen as the carbon precursor to make high percentage of substitutional carbon, and less defects by interstitials and vacancies. The large D it at oxide/strained-Si:C interface degrades the expected carrier mobility enhancement, but improvement is observed after forming gas annealing. The strained-Si source/drain with carbon incorporation is not only being stressor but also lower R s , and make a potential candidate for future high-speed ballistic devices beyond 10 nm technology node.",

keywords = "Methysilane, Strain, Strained-Si:C",

author = "Lee, \{M. H.\} and Chang, \{S. T.\} and Lee, \{S. W.\} and Chen, \{P. S.\} and Shen, \{K. W.\} and Wang, \{W. C.\}",

note = "Funding Information: The authors are grateful for discussion with Prof. C.W. Liu, Graduate Institute of Electronics Engineering, National Taiwan University, and support by National Science Council (NSC 96-2112-M-003-013), National Nano Device Laboratories (NDL), and Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute (EOL/ITRI), Taiwan.",

year = "2008",

month = jul,

day = "30",

doi = "10.1016/j.apsusc.2008.02.179",

language = "English",

volume = "254",

pages = "6147--6150",

journal = "Applied Surface Science",

issn = "0169-4332",

publisher = "Elsevier BV",

number = "19",

}

TY - JOUR

T1 - Strained-Si with carbon incorporation for MOSFET source/drain engineering

AU - Lee, M. H.

AU - Chang, S. T.

AU - Lee, S. W.

AU - Chen, P. S.

AU - Shen, K. W.

AU - Wang, W. C.

N1 - Funding Information: The authors are grateful for discussion with Prof. C.W. Liu, Graduate Institute of Electronics Engineering, National Taiwan University, and support by National Science Council (NSC 96-2112-M-003-013), National Nano Device Laboratories (NDL), and Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute (EOL/ITRI), Taiwan.

PY - 2008/7/30

Y1 - 2008/7/30

N2 - The carbon incorporation in strained-Si source/drain of MOSFET is demonstrated. The methylsilane (CH 3 SiH 3 ) is chosen as the carbon precursor to make high percentage of substitutional carbon, and less defects by interstitials and vacancies. The large D it at oxide/strained-Si:C interface degrades the expected carrier mobility enhancement, but improvement is observed after forming gas annealing. The strained-Si source/drain with carbon incorporation is not only being stressor but also lower R s , and make a potential candidate for future high-speed ballistic devices beyond 10 nm technology node.

AB - The carbon incorporation in strained-Si source/drain of MOSFET is demonstrated. The methylsilane (CH 3 SiH 3 ) is chosen as the carbon precursor to make high percentage of substitutional carbon, and less defects by interstitials and vacancies. The large D it at oxide/strained-Si:C interface degrades the expected carrier mobility enhancement, but improvement is observed after forming gas annealing. The strained-Si source/drain with carbon incorporation is not only being stressor but also lower R s , and make a potential candidate for future high-speed ballistic devices beyond 10 nm technology node.

KW - Methysilane

KW - Strain

KW - Strained-Si:C

UR - https://www.scopus.com/pages/publications/45049087730

UR - https://www.scopus.com/pages/publications/45049087730#tab=citedBy

U2 - 10.1016/j.apsusc.2008.02.179

DO - 10.1016/j.apsusc.2008.02.179

M3 - Article

AN - SCOPUS:45049087730

SN - 0169-4332

VL - 254

SP - 6147

EP - 6150

JO - Applied Surface Science

JF - Applied Surface Science

IS - 19

ER -

Strained-Si with carbon incorporation for MOSFET source/drain engineering

Abstract

Keywords

ASJC Scopus subject areas

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