SOP package surface discoloration after PCT test

Mu Chun Wang, Hsin Chia Yang, Chuan-Hsi Liu, Ren Hau Yang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Although the new assembly technology is developed well in this recent era, the conventional surface mount package technology such as dual-side small-outline package (SOP) is still useful to the common commercial IC products. If the IC products will be delivered to the market, they must pass the reliability tests such as the pressure cook test (PCT). Unfortunately, some tested products depicted an outlook of metal migration on the surface of the packaged ICs after this product reliability test. The stressed ICs with discoloration showed a function fail.

Original languageEnglish
Title of host publicationICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
Pages855-858
Number of pages4
DOIs
Publication statusPublished - 2011 Nov 22
Event2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011 - Shanghai, China
Duration: 2011 Aug 82011 Aug 11

Other

Other2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011
CountryChina
CityShanghai
Period11/8/811/8/11

Fingerprint

Discoloration
Metals

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Wang, M. C., Yang, H. C., Liu, C-H., & Yang, R. H. (2011). SOP package surface discoloration after PCT test. In ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging (pp. 855-858). [6066964] https://doi.org/10.1109/ICEPT.2011.6066964

SOP package surface discoloration after PCT test. / Wang, Mu Chun; Yang, Hsin Chia; Liu, Chuan-Hsi; Yang, Ren Hau.

ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. 2011. p. 855-858 6066964.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Wang, MC, Yang, HC, Liu, C-H & Yang, RH 2011, SOP package surface discoloration after PCT test. in ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging., 6066964, pp. 855-858, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, China, 11/8/8. https://doi.org/10.1109/ICEPT.2011.6066964
Wang MC, Yang HC, Liu C-H, Yang RH. SOP package surface discoloration after PCT test. In ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. 2011. p. 855-858. 6066964 https://doi.org/10.1109/ICEPT.2011.6066964
Wang, Mu Chun ; Yang, Hsin Chia ; Liu, Chuan-Hsi ; Yang, Ren Hau. / SOP package surface discoloration after PCT test. ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. 2011. pp. 855-858
@inproceedings{eb3c34b96e5e4e80af3a52bf4a1cbc58,
title = "SOP package surface discoloration after PCT test",
abstract = "Although the new assembly technology is developed well in this recent era, the conventional surface mount package technology such as dual-side small-outline package (SOP) is still useful to the common commercial IC products. If the IC products will be delivered to the market, they must pass the reliability tests such as the pressure cook test (PCT). Unfortunately, some tested products depicted an outlook of metal migration on the surface of the packaged ICs after this product reliability test. The stressed ICs with discoloration showed a function fail.",
author = "Wang, {Mu Chun} and Yang, {Hsin Chia} and Chuan-Hsi Liu and Yang, {Ren Hau}",
year = "2011",
month = "11",
day = "22",
doi = "10.1109/ICEPT.2011.6066964",
language = "English",
isbn = "9781457717680",
pages = "855--858",
booktitle = "ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging",

}

TY - GEN

T1 - SOP package surface discoloration after PCT test

AU - Wang, Mu Chun

AU - Yang, Hsin Chia

AU - Liu, Chuan-Hsi

AU - Yang, Ren Hau

PY - 2011/11/22

Y1 - 2011/11/22

N2 - Although the new assembly technology is developed well in this recent era, the conventional surface mount package technology such as dual-side small-outline package (SOP) is still useful to the common commercial IC products. If the IC products will be delivered to the market, they must pass the reliability tests such as the pressure cook test (PCT). Unfortunately, some tested products depicted an outlook of metal migration on the surface of the packaged ICs after this product reliability test. The stressed ICs with discoloration showed a function fail.

AB - Although the new assembly technology is developed well in this recent era, the conventional surface mount package technology such as dual-side small-outline package (SOP) is still useful to the common commercial IC products. If the IC products will be delivered to the market, they must pass the reliability tests such as the pressure cook test (PCT). Unfortunately, some tested products depicted an outlook of metal migration on the surface of the packaged ICs after this product reliability test. The stressed ICs with discoloration showed a function fail.

UR - http://www.scopus.com/inward/record.url?scp=81355131853&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=81355131853&partnerID=8YFLogxK

U2 - 10.1109/ICEPT.2011.6066964

DO - 10.1109/ICEPT.2011.6066964

M3 - Conference contribution

AN - SCOPUS:81355131853

SN - 9781457717680

SP - 855

EP - 858

BT - ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging

ER -