SOP package surface discoloration after PCT test

Mu Chun Wang, Hsin Chia Yang, Chuan-Hsi Liu, Ren Hau Yang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Although the new assembly technology is developed well in this recent era, the conventional surface mount package technology such as dual-side small-outline package (SOP) is still useful to the common commercial IC products. If the IC products will be delivered to the market, they must pass the reliability tests such as the pressure cook test (PCT). Unfortunately, some tested products depicted an outlook of metal migration on the surface of the packaged ICs after this product reliability test. The stressed ICs with discoloration showed a function fail.

Original languageEnglish
Title of host publicationICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
Pages855-858
Number of pages4
DOIs
Publication statusPublished - 2011 Nov 22
Event2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011 - Shanghai, China
Duration: 2011 Aug 82011 Aug 11

Other

Other2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011
CountryChina
CityShanghai
Period11/8/811/8/11

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Wang, M. C., Yang, H. C., Liu, C-H., & Yang, R. H. (2011). SOP package surface discoloration after PCT test. In ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging (pp. 855-858). [6066964] https://doi.org/10.1109/ICEPT.2011.6066964