Abstract
Although the new assembly technology is developed well in this recent era, the conventional surface mount package technology such as dual-side small-outline package (SOP) is still useful to the common commercial IC products. If the IC products will be delivered to the market, they must pass the reliability tests such as the pressure cook test (PCT). Unfortunately, some tested products depicted an outlook of metal migration on the surface of the packaged ICs after this product reliability test. The stressed ICs with discoloration showed a function fail.
| Original language | English |
|---|---|
| Title of host publication | ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging |
| Pages | 855-858 |
| Number of pages | 4 |
| DOIs | |
| Publication status | Published - 2011 Nov 22 |
| Event | 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011 - Shanghai, China Duration: 2011 Aug 8 → 2011 Aug 11 |
Other
| Other | 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011 |
|---|---|
| Country | China |
| City | Shanghai |
| Period | 11/8/8 → 11/8/11 |
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ASJC Scopus subject areas
- Electrical and Electronic Engineering
Cite this
SOP package surface discoloration after PCT test. / Wang, Mu Chun; Yang, Hsin Chia; Liu, Chuan-Hsi; Yang, Ren Hau.
ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. 2011. p. 855-858 6066964.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - SOP package surface discoloration after PCT test
AU - Wang, Mu Chun
AU - Yang, Hsin Chia
AU - Liu, Chuan-Hsi
AU - Yang, Ren Hau
PY - 2011/11/22
Y1 - 2011/11/22
N2 - Although the new assembly technology is developed well in this recent era, the conventional surface mount package technology such as dual-side small-outline package (SOP) is still useful to the common commercial IC products. If the IC products will be delivered to the market, they must pass the reliability tests such as the pressure cook test (PCT). Unfortunately, some tested products depicted an outlook of metal migration on the surface of the packaged ICs after this product reliability test. The stressed ICs with discoloration showed a function fail.
AB - Although the new assembly technology is developed well in this recent era, the conventional surface mount package technology such as dual-side small-outline package (SOP) is still useful to the common commercial IC products. If the IC products will be delivered to the market, they must pass the reliability tests such as the pressure cook test (PCT). Unfortunately, some tested products depicted an outlook of metal migration on the surface of the packaged ICs after this product reliability test. The stressed ICs with discoloration showed a function fail.
UR - http://www.scopus.com/inward/record.url?scp=81355131853&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=81355131853&partnerID=8YFLogxK
U2 - 10.1109/ICEPT.2011.6066964
DO - 10.1109/ICEPT.2011.6066964
M3 - Conference contribution
AN - SCOPUS:81355131853
SN - 9781457717680
SP - 855
EP - 858
BT - ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
ER -