SOP package surface discoloration after PCT test

Mu Chun Wang; Hsin Chia Yang; Chuan-Hsi Liu; Ren Hau Yang

doi:10.1109/ICEPT.2011.6066964

SOP package surface discoloration after PCT test

Mu Chun Wang, Hsin Chia Yang, Chuan-Hsi Liu, Ren Hau Yang

Department of Mechartronic Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

Although the new assembly technology is developed well in this recent era, the conventional surface mount package technology such as dual-side small-outline package (SOP) is still useful to the common commercial IC products. If the IC products will be delivered to the market, they must pass the reliability tests such as the pressure cook test (PCT). Unfortunately, some tested products depicted an outlook of metal migration on the surface of the packaged ICs after this product reliability test. The stressed ICs with discoloration showed a function fail.

Original language	English
Title of host publication	ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging
Pages	855-858
Number of pages	4
DOIs	https://doi.org/10.1109/ICEPT.2011.6066964
Publication status	Published - 2011 Nov 22
Event	2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011 - Shanghai, China Duration: 2011 Aug 8 → 2011 Aug 11

Other

Other	2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011
Country	China
City	Shanghai
Period	2011/08/08 → 2011/08/11

ASJC Scopus subject areas

Electrical and Electronic Engineering

Access to Document

10.1109/ICEPT.2011.6066964

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Wang, MC, Yang, HC, Liu, C-H & Yang, RH 2011, SOP package surface discoloration after PCT test. in ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging., 6066964, pp. 855-858, 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, Shanghai, China, 2011/08/08. https://doi.org/10.1109/ICEPT.2011.6066964

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abstract = "Although the new assembly technology is developed well in this recent era, the conventional surface mount package technology such as dual-side small-outline package (SOP) is still useful to the common commercial IC products. If the IC products will be delivered to the market, they must pass the reliability tests such as the pressure cook test (PCT). Unfortunately, some tested products depicted an outlook of metal migration on the surface of the packaged ICs after this product reliability test. The stressed ICs with discoloration showed a function fail.",

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AB - Although the new assembly technology is developed well in this recent era, the conventional surface mount package technology such as dual-side small-outline package (SOP) is still useful to the common commercial IC products. If the IC products will be delivered to the market, they must pass the reliability tests such as the pressure cook test (PCT). Unfortunately, some tested products depicted an outlook of metal migration on the surface of the packaged ICs after this product reliability test. The stressed ICs with discoloration showed a function fail.

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