Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics

Y. J. Chen; C. K. Chung; C. R. Yang; C. R. Kao

doi:10.1016/j.microrel.2012.06.116

Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics

Y. J. Chen, C. K. Chung, C. R. Yang, C. R. Kao^*

^*Corresponding author for this work

Department of Mechatronic Engineering

Research output: Contribution to journal › Article › peer-review

56 Citations (Scopus)

Abstract

This study investigates the effects of intermetallics (IMCs) on the single-joint shear strength of 50 μm diameter Cu pillar bumps joined with Sn-4.0%Ag-0.5%Cu (SAC405) solder caps. The correlations between the shear strength of the Cu pillar bumps and the IMCs aged at 180°C for 150, 300, 500, and 750 h are studied. Microstructure characterization reveals that the Cu₆Sn₅ morphology transforms from scallop-type to planar-type after 150 h of aging. Void formations are observed at the Cu ₃Sn/Cu interface after 300 h of aging and the amount of void formations increases with aging time. The shear test result shows that the shear strength decreases with aging time. Although the void formations did contribute to the deterioration of the solder joint strength, the main contributing factor was the planarization of the Cu₆Sn₅ morphology through the aging process. The failure modes of the solder joint are also discussed in this study.

Original language	English
Pages (from-to)	47-52
Number of pages	6
Journal	Microelectronics Reliability
Volume	53
Issue number	1
DOIs	https://doi.org/10.1016/j.microrel.2012.06.116
Publication status	Published - 2013 Jan

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Safety, Risk, Reliability and Quality
Surfaces, Coatings and Films
Atomic and Molecular Physics, and Optics
Electrical and Electronic Engineering

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10.1016/j.microrel.2012.06.116

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title = "Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics",

abstract = "This study investigates the effects of intermetallics (IMCs) on the single-joint shear strength of 50 μm diameter Cu pillar bumps joined with Sn-4.0%Ag-0.5%Cu (SAC405) solder caps. The correlations between the shear strength of the Cu pillar bumps and the IMCs aged at 180°C for 150, 300, 500, and 750 h are studied. Microstructure characterization reveals that the Cu6Sn5 morphology transforms from scallop-type to planar-type after 150 h of aging. Void formations are observed at the Cu 3Sn/Cu interface after 300 h of aging and the amount of void formations increases with aging time. The shear test result shows that the shear strength decreases with aging time. Although the void formations did contribute to the deterioration of the solder joint strength, the main contributing factor was the planarization of the Cu6Sn5 morphology through the aging process. The failure modes of the solder joint are also discussed in this study.",

author = "Chen, {Y. J.} and Chung, {C. K.} and Yang, {C. R.} and Kao, {C. R.}",

note = "Funding Information: This work was supported by National Science Council of Taiwan through grant NSC-98-2221-E-002-060-MY3, and by National Taiwan University through grant 10R80920-04. The solder ball was supplied by Senju Metal Industry Co., is also acknowledged. ",

year = "2013",

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doi = "10.1016/j.microrel.2012.06.116",

language = "English",

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AU - Chung, C. K.

AU - Yang, C. R.

AU - Kao, C. R.

N1 - Funding Information: This work was supported by National Science Council of Taiwan through grant NSC-98-2221-E-002-060-MY3, and by National Taiwan University through grant 10R80920-04. The solder ball was supplied by Senju Metal Industry Co., is also acknowledged.

PY - 2013/1

Y1 - 2013/1

N2 - This study investigates the effects of intermetallics (IMCs) on the single-joint shear strength of 50 μm diameter Cu pillar bumps joined with Sn-4.0%Ag-0.5%Cu (SAC405) solder caps. The correlations between the shear strength of the Cu pillar bumps and the IMCs aged at 180°C for 150, 300, 500, and 750 h are studied. Microstructure characterization reveals that the Cu6Sn5 morphology transforms from scallop-type to planar-type after 150 h of aging. Void formations are observed at the Cu 3Sn/Cu interface after 300 h of aging and the amount of void formations increases with aging time. The shear test result shows that the shear strength decreases with aging time. Although the void formations did contribute to the deterioration of the solder joint strength, the main contributing factor was the planarization of the Cu6Sn5 morphology through the aging process. The failure modes of the solder joint are also discussed in this study.

AB - This study investigates the effects of intermetallics (IMCs) on the single-joint shear strength of 50 μm diameter Cu pillar bumps joined with Sn-4.0%Ag-0.5%Cu (SAC405) solder caps. The correlations between the shear strength of the Cu pillar bumps and the IMCs aged at 180°C for 150, 300, 500, and 750 h are studied. Microstructure characterization reveals that the Cu6Sn5 morphology transforms from scallop-type to planar-type after 150 h of aging. Void formations are observed at the Cu 3Sn/Cu interface after 300 h of aging and the amount of void formations increases with aging time. The shear test result shows that the shear strength decreases with aging time. Although the void formations did contribute to the deterioration of the solder joint strength, the main contributing factor was the planarization of the Cu6Sn5 morphology through the aging process. The failure modes of the solder joint are also discussed in this study.

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Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics

Abstract

ASJC Scopus subject areas

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