This study presents an effective, simple and inexpensive process for forming micro-scale vertical structures on a (100) silicon wafer. Several modified etchants and micro-patterns including rectangular, snake-like, circular and comb patterns were employed to determine the optimum etching process. We found that an etchant solution consisting of 4.6M hydrofluoric acid, 0.44M hydrogen peroxide and isopropyl alcohol produces microstructures at an etching rate of 0.47m min 1and surface roughness of 17.4nm. All the patterns were transferred faithfully to the silicon substrate.
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Mechanics of Materials
- Mechanical Engineering
- Electrical and Electronic Engineering