Si-capping thicknesses impacting compressive strained MOSFETs with temperature effect

Mu Chun Wang, Ssu Hao Peng, Shea Jue Wang*, Hsin Chia Yang, Wen Shiang Liao, Chao Wang Li, Chuan Hsi Liu

*Corresponding author for this work

Research output: Contribution to conferencePaperpeer-review

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Engineering & Materials Science