Semiconducting tellurium-iron-copper carbonyl polymers

Minghuey Shieh*, Chia Hua Ho, Wen Shyan Sheu, Bo Gaun Chen, Yen Yi Chu, Chia Yeh Miu, Hsiang Lin Liu, Chih Chiang Shen

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

35 Citations (Scopus)

Abstract

The unprecedented ternary Te-Fe-Cu chain polymers [{Et4N}{TeFe3(CO)9Cu}]α and [{TeFe3(CO)9Cu2}(μ-4,4′-dipyridyl)1.5]α were prepared from the self-assembly of [Et4N]2[TeFe3(CO)9] with [Cu(MeCN)4][BF4] in THF or in the presence of 4,4′-dipyridyl in THF. These two chain polymers, which can also be constructed from the precursor complex TeFe3(CO)9Cu2(MeCN)2, show semiconducting behaviors with low band gaps of ∼0.59 and ∼0.41 eV, respectively. In addition, their conductivity and the effect of the bridging ligand are further elucidated by theoretical calculations.

Original languageEnglish
Pages (from-to)14114-14116
Number of pages3
JournalJournal of the American Chemical Society
Volume130
Issue number43
DOIs
Publication statusPublished - 2008 Oct 29

ASJC Scopus subject areas

  • Catalysis
  • General Chemistry
  • Biochemistry
  • Colloid and Surface Chemistry

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